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Building Complex Chips That Last Longer


Semiconductor Engineering sat down to talk about design challenges in advanced packages and nodes with John Lee, vice president and general manager for semiconductors at Ansys; Shankar Krishnamoorthy, general manager of Synopsys' Design Group; Simon Burke, distinguished engineer at Xilinx; and Andrew Kahng, professor of CSE and ECE at UC San Diego. This discussion was held at the Ansys IDEAS co... » read more

In-field, In-Mission Reliability Monitoring Based On Deep Data


This paper describes a Deep Data approach to reliability monitoring in advanced electronics, based on degradation as a precursor for failure. By applying machine learning algorithms and analytics to data created by on-chip monitoring IPs (Agents), IC/system health and performance can be continuously monitored, at all stages of the product lifecycle. Realtime degradation analysis of critical par... » read more

Improving Reliability Monitoring Of High-Bandwidth Memory


As the quest for increased bandwidth and speed continues, multi-die technologies with advanced memory architectures are introduced. As the complexity of these heterogenous packaging continues to develop, new reliability challenges arise. A new approach to HBM subsystem monitoring and repair provides advanced in-field reliability assurance. By applying analytics to data created by on-chip Age... » read more