tag: in-field monitoring

Automotive Electronics Reliability Requires In-Field Silicon Monitoring
By Lorin Kennedy - 11 Jun, 2024 - Comments: 1

By Lorin Kennedy and Dan Alexandrescu For everyday consumers, no products require reliability more than automobiles. While consumers may be willing accept their laptops and phones limiting performance or abruptly turning off when systems reach unacceptable temperature levels, that is not the case for the reliability of Advanced Driver-Assistance Systems (ADAS) or other safety critical system... » read more

Increased Automotive Data Use Raises Privacy, Security Concerns
By John Koon - 07 Mar, 2024 - Comments: 0

The amount of data being collected, processed, and stored in vehicles is exploding, and so is the value of that data. That raises questions that are still not fully answered about how that data will be used, by whom, and how it will be secured. Automakers are competing based on the latest versions of advanced technologies such as ADAS, 5G, and V2X, but the ECUs, software-defined vehicles, an... » read more

Ramping Up IC Predictive Maintenance
By Anne Meixner - 07 Feb, 2023 - Comments: 0

The chip industry is starting to add technology that can predict impending failures early enough to stave off serious problems, both in manufacturing and in the field. Engineers increasingly are employing in-circuit monitors embedded in SoC designs to catch device failures earlier in the production flow. But for ICs in the field, data tracing from design to application use only recently has ... » read more

Looking Inside Of Chips
By Ed Sperling - 10 Jan, 2023 - Comments: 0

Shai Cohen, co-founder and CEO of proteanTecs, sat down with Semiconductor Engineering to talk about how to boost reliability and add resiliency into chips and advanced packaging. What follows are excerpts of that conversation. SE: Several years ago, no one was thinking about on-chip monitoring. What's changed? Cohen: Today it is obvious that a solution is needed for optimizing performanc... » read more

Building Complex Chips That Last Longer
By Ed Sperling - 23 Sep, 2021 - Comments: 0

Semiconductor Engineering sat down to talk about design challenges in advanced packages and nodes with John Lee, vice president and general manager for semiconductors at Ansys; Shankar Krishnamoorthy, general manager of Synopsys' Design Group; Simon Burke, distinguished engineer at Xilinx; and Andrew Kahng, professor of CSE and ECE at UC San Diego. This discussion was held at the Ansys IDEAS co... » read more

In-field, In-Mission Reliability Monitoring Based On Deep Data
By proteanTecs - 08 Jun, 2021 - Comments: 0

This paper describes a Deep Data approach to reliability monitoring in advanced electronics, based on degradation as a precursor for failure. By applying machine learning algorithms and analytics to data created by on-chip monitoring IPs (Agents), IC/system health and performance can be continuously monitored, at all stages of the product lifecycle. Realtime degradation analysis of critical par... » read more

Improving Reliability Monitoring Of High-Bandwidth Memory
By Eyal Fayneh - 10 Dec, 2019 - Comments: 0

As the quest for increased bandwidth and speed continues, multi-die technologies with advanced memory architectures are introduced. As the complexity of these heterogenous packaging continues to develop, new reliability challenges arise. A new approach to HBM subsystem monitoring and repair provides advanced in-field reliability assurance. By applying analytics to data created by on-chip Age... » read more

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