tag: Infineon Technologies

Week In Review: Design, Low Power
By Jesse Allen - 05 May, 2023 - Comments: 0

Arm advanced its progress toward an initial public offering, confidentially submitting a draft registration statement on Form F-1 to the U.S. Securities and Exchange Commission. The size and price range for the proposed offering have yet to be determined. Graphene IDM Paragraf acquired Cardea Bio, a maker of graphene-based biocompatible chips. Cardea has developed a biosignal processing unit... » read more

Driving Performance In GaN-Based USB-C Adapters And Chargers With EPR
By Infineon - 03 May, 2023 - Comments: 0

With the announcement of the USB PD 3.1 standard [1], higher power levels of up to 240 W are enabled. Still, the wide output voltage range from 5 V to 48 V raises new challenges for the converter topologies currently in use. In this white paper, the combination of an AC-DC PFC boost and a DC-DC hybrid flyback (HFB) stage [2], also well known as asymmetrical half-bridge flyback topology, is prop... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 21 Apr, 2023 - Comments: 0

Pervasive computing Broadcom announced delivery of its Jericho3-AI fabric for artificial intelligence (AI) networks, which delivers 26 petabits per second of Ethernet bandwidth. That is roughly four times the bandwidth of the previous generation, at a 40% power savings per gigabit. AMD released the Ryzen Embedded 5000 Series processors for customers requiring power-efficient processors opt... » read more

Growing Challenges For Increasingly Connected Vehicles
By John Koon - 06 Apr, 2023 - Comments: 0

Automobiles will become increasingly connected over the next decade, but that connectivity will come at a price in terms of dollars, security, and constantly changing technology. Connectivity involves all parts of a vehicle. It includes everything from autonomous driving to in-cabin monitoring and connected infotainment. And it encompasses external sensors, IoT, V2X, over-the-air communicati... » read more

XENSIV PAS CO2
By Infineon - 05 Apr, 2023 - Comments: 0

This white paper demonstrates how Infineon’s new CO2 sensor XENSIVTM PAS CO2, based on photo-acoustic spectroscopy (PAS) technology, is compatible with the sensor requirement defined by the WELL Building Standard and the LEED rating system. The evidence presented is based on conceptual and experimental data. The document also provides a detailed analysis of the contribution of the sen... » read more

Chip Industry’s Technical Paper Roundup: Apr. 4
By Linda Christensen - 04 Apr, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=90 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us p... » read more

Neuromorphic Computing: Self-Adapting HW With ReRAMs
By Technical Paper Link - 03 Apr, 2023 - Comments: 0

A new technical paper titled "A self-adaptive hardware with resistive switching synapses for experience-based neurocomputing" was published by researchers at Infineon Technologies, Politecnico di Milano and IUNET, Weebit Nano, and CEA Leti. Abstract "Neurobiological systems continually interact with the surrounding environment to refine their behaviour toward the best possible reward. Achie... » read more

Week In Review: Design, Low Power
By Jesse Allen - 17 Mar, 2023 - Comments: 0

The UK government published its National Quantum Strategy, which outlines the plan to invest £2.5 billion (~$3.0 billion) over the next 10 years into quantum technology, including computing, sensing, timing, imaging, and networking. "We will develop UK strengths across different hardware platforms, software, and components, and reinforce our capabilities throughout the supply chains. Although ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 10 Mar, 2023 - Comments: 0

Arm is expected to list solely on a U.S. stock exchange when it goes public again later this year, forgoing the London Stock Exchange for now, the BBC reports. Global investment banks expect the offering to value the company between $30 billion and $70 billion, according to Bloomberg. Disaggregating chips into specialized processors, memories, and architectures is becoming necessary for cont... » read more

Week In Review: Design, Low Power
By Jesse Allen - 03 Mar, 2023 - Comments: 0

Apple plans to spend an additional €1 billion (~$1.1B) over the next six years to expand its Munich, Germany-based Silicon Design Centre, including the construction of a new research facility. "The expansion of our European Silicon Design Centre will enable an even closer collaboration between our more than 2,000 engineers in Bavaria working on breakthrough innovations, including custom sil... » read more

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