tag: Infineon

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 25 Feb, 2022 - Comments: 0

Security Fraunhofer IIS received a grant to establish an R&D center for trustworthy integrated electronic systems for security and safety. Working with other Fraunhofer divisions, Fraunhofer IIS will use innovative methods in design and testing to help protect IP along the value chain of microelectronic components and systems. The center will focus on creating a secure design flow for inte... » read more

Unintended Coupling Issues Grow
By Brian Bailey - 24 Feb, 2022 - Comments: 0

The number of indirect and often unexpected ways in which one design element may be affected by another is growing, making it more difficult to ensure a chip — or multiple chips in a package — will perform reliably. Long gone are the days when the only way that one part of a circuit could influence another was by an intended wire connecting them. As geometries get smaller, frequencies go... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 18 Feb, 2022 - Comments: 0

Chipmakers Intel has announced a definitive agreement to acquire Tower, a specialty foundry vendor, for approximately $5.4 billion. With the acquisition of Tower, Intel expands its efforts in the foundry business, and put its rivals on notice. With Tower, Intel gains access to mature processes as well as specialty technologies, such as analog, CMOS image sensor, MEMS, power management and RF. ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 18 Feb, 2022 - Comments: 0

AMD completed its acquisition of Xilinx. The all-stock deal ended up being valued at approximately $50 billion due to a rise in AMD's share price (the deal was valued at $35 billion when announced). The Xilinx business will become the newly formed Adaptive and Embedded Computing Group (AECG), led by former Xilinx CEO Victor Peng, and will continue its FPGA, adaptive SoC, and software roadmaps a... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 18 Feb, 2022 - Comments: 0

Automotive Renesas and AVL Software and Functions are collaborating to support developers of automotive ISO 26262-compliant electronic control units (ECUs). Renesas sells automotive R-Car SoCs, RH850 automotive control MCUs, PMICs, and software for levels ASIL B to ASIL D of ISO26262, but even with automotive ISO26262 parts, ECU system development process is never plug and play. Functional saf... » read more

Silicon-based Power Semis Face Challenges
By Mark LaPedus - 17 Feb, 2022 - Comments: 0

Suppliers of power semiconductors continue to develop and ship devices based on traditional silicon technology, but silicon is nearing its limits and faces increased competition from technologies like GaN and SiC. In response, the industry is finding ways to extend traditional silicon-based power devices. Chipmakers are eking out more performance and prolonging the technology, at least in th... » read more

Why Data Center Power Will Never Come Down
By Bryon Moyer - 10 Feb, 2022 - Comments: 3

Data centers have become significant consumers of energy. In order to deal with the proliferation of data centers and the servers within them, there is a big push to reduce the energy consumption of all data center components. With all that effort, will data center power really come down? The answer is no, despite huge improvements in energy efficiency. “Keeping data center power consum... » read more

Realizing The Future Of Fast EV Charging Through CoolSiC Based Topology Design
By Infineon - 09 Feb, 2022 - Comments: 0

While consumers are keen to reduce their carbon footprint, the move to E-Mobility, especially private electric vehicles (EV), is hindered by the limited charging infrastructure, most notably in fast charging. This white paper reviews the charging landscape and examines implementation approaches for fast DC chargers. Specific focus is placed on chargers delivering 350 kW and more for fast electr... » read more

Week In Review: Design, Low Power
By Jesse Allen - 04 Feb, 2022 - Comments: 0

Tools & IP Ansys updated its product suite, adding new tools and workflows in Ansys 2022 R1. It adds Phi Plus meshing technology to improve simulation of PCB and complex 3D IC packaging. It also introduces RedHawk-SC SigmaDVD, a statistically realistic modeling technique to identify the worst-case dynamic voltage-drop in hours and make it possible to achieve near 100% coverage of all relev... » read more

Why Does “Matter” Matter?
By Skip Ashton - 03 Feb, 2022 - Comments: 0

There is a good chance that you have come across "Matter" in recent news related to IoT and smart home. Matter was everywhere at CES 2022, and smart home ecosystems all talk about Matter when launching new devices. Matter helps IoT devices like your coffee maker and smart speaker talk to each other easily so that you as the end user don’t need to read complex user manuals or become an IoT con... » read more

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