Week In Review: Auto, Security, Pervasive Computing

Fraunhofer security center funding; Codasip’s RISC-V AI on edge; Arm’s 5G Lab catches on.


Fraunhofer IIS received a grant to establish an R&D center for trustworthy integrated electronic systems for security and safety. Working with other Fraunhofer divisions, Fraunhofer IIS will use innovative methods in design and testing to help protect IP along the value chain of microelectronic components and systems. The center will focus on creating a secure design flow for integrated circuits, new integrated hardware IPs, microprocessor subsystems, and complex circuits. Bavarian companies will have access to the research and subject matter experts.

Pervasive computing, IoT, 5G and beyond
Codasip announced two new RISC-V processor cores suitable for AI/ML edge computing, specifically for Iot and IIoT. The low-power embedded processors L31 and L11 use Google TensorFlowLite for Microcontrollers (TFLite Micro) with Codasip Studio tools that enable customizing both the ISA and the microarchitecture. The L31 and L11 are the first Codasip RISC-V cores to have TFLite Micro support, but Codasip plans to make TFLite Micro support available in other cores.

Renesas unveiled its new 2.4 GHz RF transceiver technologies that support the Bluetooth low energy, low power, near-field communication standard for IoT devices. The new technologies also achieve a smaller mounting area and better power efficiency.

Arm says that companies participating in its Arm 5G Solutions Lab has increased 5-fold since the lab opened four months ago. The first live use cases from the Lab are also coming to fruition for the telco community, including a private 5G network-in-a-box with MEC support and small cell projects using the Qualcomm FSM100xx 5G RAN platform that supports both sub-6 GHz and mmWaves.

AMD is now offering its compute-optimized Amazon EC2 C6a instances as generally available to run on AMD EPYC processors.  The instances compute heavy workloads using a    “Amazon EC2 C6a instances, powered by 3rd Gen AMD EPYC processors, continue our collaboration with AMD, providing customers the ability to run compute intensive workloads,” said David Brown, vice president, Amazon EC2, AWS, in a press release. AMD says its C6a instances have high core density enabling up to two large instances sizes, 128 vCPUs and 192 vCPUs, the largest with 384 GB of memory, twice the size of the largest C5a instances.

Infineon Technologies added four small antenna tuners with new antenna tuning switches to its portfolio. These devices are suitable for sub-7.2 GHz New Radio (NR) applications,  and can be used for both 4G and 5G in smartphones, notebooks, wearables, VR headsets, smart home, among other cellular applications. The antenna tuners are the BGSA144ML10, BGSA400ML10, and BGSA403ML10 in the 1.1 x 1.5 mm 2 TSLP 10-pin package. The BGSA14M2N10 is a 0.95 x 1.3 mm 2 TSNP 10-pin package with 350 μm pad pitch.

Mobile World Congress in Barcelona opens this upcoming week in person in Barcelona.

Siemens Digital Industries Software worked with NVIDIA to accelerate computational fluid dynamics (CFD) simulations, resulting in the Simcenter STAR-CCM+ 2022.1. Part of the Xcelerator portfolio of software and services, Simcenter STAR-CCM+ 2022.1 software uses CUDA-enabled GPU acceleration to deliver faster turnaround times at lower hardware investment costs to CFD simulation within design and engineering organizations of every size. “With GPU-enabled technology, users can achieve faster turnaround time of CFD simulations at significantly lower per-simulation cost,” said Stamatina Petropoulou, technical product management,  Siemens Digital Industries Software in a press release. “This technology will enable engineers working on external aerodynamics, aerospace, building and infrastructure / civil engineering applications, etc. to massively improve their simulation throughput at equivalent hardware investments with an increased per-dollar performance of GPUs compared to CPUs.”

Cadence and Dassualt Systèmes have combined some of their tools to offer companies a way to make virtual twins of electromechanical systems, including transportation and automotive use cases. The companies have formed a joint simulation tool out of Dassault Systèmes’ 3DEXPERIENCE platform with the Cadence’s Allegro platform, which cam be used to develop safe  electronic systems that are safe and high quality.

Read more news at Manufacturing, Test and Design, Low Power.

More to check out on Semiconductor Engineering:
• Read the latest Automotive, Security, & Pervasive Computing newsletter.
• Find industry jobs and upcoming conferences and webinars.
• Boost your semiconductor industry knowledge.
• Check out the Semiconductor Engineering video library.

Leave a Reply

(Note: This name will be displayed publicly)