tag: Infineon

Problems In The Power Grid
By Ed Sperling - 22 Jun, 2021 - Comments: 1

The gap is widening between power availability and peak demand. Ritesh Tyagi, head of innovation and growth strategy at Infineon Technologies, talks about what needs to be done to fix the power grid, particularly as more cars are electrified and more electronic devices are mobile. While there currently is a surplus in power being generated on a macro level in the United States, for example, it�... » read more

Fan-Out Packaging Options Grow
By Mark LaPedus - 17 Jun, 2021 - Comments: 0

Chipmakers, OSATs and R&D organizations are developing the next wave of fan-out packages for a range of applications, but sorting out the new options and finding the right solution is proving to be a challenge. Fan-out is a way to assemble one or more dies in an advanced package, enabling chips with better performance and more I/Os for applications like computing, IoT, networking and sma... » read more

Shifting Toward Data-Driven Chip Architectures
By Ed Sperling and Ann Mutschler - 16 Jun, 2021 - Comments: 0

An explosion in data is forcing chipmakers to rethink where to process data, which are the best types of processors and memories for different types of data, and how to structure, partition and prioritize the movement of raw and processed data. New chips from systems companies such as Google, Facebook, Alibaba, and IBM all incorporate this approach. So do those developed by vendors like Appl... » read more

Blog Review: June 16
By Jesse Allen - 16 Jun, 2021 - Comments: 0

Arm's Adrian Herrera explores the latest version of AMBA ATP Engine, an open-source implementation of the AMBA Adaptive Traffic Profiles (ATP) synthetic traffic framework specification, which adds the ability to program AMBA ATP traffic generation from Linux environments. Cadence's Paul McLellan finds out just how effective glitching chips is by delivering incorrect voltages and clock freque... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 11 Jun, 2021 - Comments: 0

Chipmakers SiFive has received a takeover offer from Intel, according to a report from Bloomberg. The asking price is more than $2 billion. ------------------------------------------------------------------ IBM has filed suit against GlobalFoundries (GF), alleging fraud and breach of contract committed by GF. IBM’s suit, filed in the Supreme Court of the state of New York, seeks relief... » read more

Week In Review: Design, Low Power
By Jesse Allen - 11 Jun, 2021 - Comments: 0

Siemens Digital Industries Software acquired Pro Design's proFPGA product family of FPGA desktop prototyping technologies. Through a prior OEM relationship, proFPGA technology is already part of the Xcelerator portfolio; Siemens noted that the acquisition will allow for fuller integration with its Veloce hardware-assisted verification system. Pro Design will continue to operate as an independen... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 11 Jun, 2021 - Comments: 0

Pervasive computing — IoT, edge, cloud, data center, and back Xilinx introduced its Versal AI Edge series of adaptive SoCs, or adaptive compute acceleration platforms (ACAPs), that can be manage AI-ML workloads in edge applications. The chip is designed for flexible, low latency, edge applications where algorithms may need updating. The software programmable chips have an AI Engine-ML featur... » read more

SiC And Industrial Servos: A Perfect Match
By Michael Ebli - 10 Jun, 2021 - Comments: 0

The automation engineers of the 1960s would look with envy at the servo technology in use today. Small, precise, and, above all, electric, they are a reflection of the compactness of the semiconductor control, sensor, and power technology we have available today. Today’s biggest challenge remains the cabling between the servo and its controller. Notoriously expensive, due to having to withsta... » read more

Customizing Chips For Power And Performance
By Ed Sperling - 10 Jun, 2021 - Comments: 0

Sandro Cerato, senior vice president and CTO of the Power & Sensor Systems Business Unit at Infineon Technologies, sat down with Semiconductor Engineering to talk about fundamental shifts in chip design with the rollout of the edge, AI, and more customized solutions. What follows are excerpts of that conversation. SE: The chip market is starting to fall into three distinct buckets, the e... » read more

A Revolution For Power Conversion Systems — CoolSiC MOSFET
By Infineon - 09 Jun, 2021 - Comments: 0

Silicon carbide (SiC) transistors are increasingly used in power converters, placing high demands on the size, weight and/or efficiency. The outstanding material properties of SiC enable the design of fastswitching unipolar devices as opposed to bipolar IGBT devices. Thus, solutions which have been up to now possible in the low-voltage world only (< 600 V) are now possible at higher voltages... » read more

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