tag: inspection

The Human Hand: Curating Good Data And Creating An Effective Deep-Learning R2R Strategy For High-Volume Manufacturing
By Onto Innovation - 09 Aug, 2022 - Comments: 0

Currently, the semiconductor manufacturing industry uses artificial intelligence and machine learning to take data and autonomously learn from that data. With the additional data, AI and ML can be used to quickly discover patterns and determine correlations in various applications, most notably those applications involving metrology and inspection, whether in the front-end of the manufacturing ... » read more

Publicly Available Dataset for PCB X-Ray Inspection (FICS- University of Florida)
By Technical Paper Link - 19 Jul, 2022 - Comments: 0

Researchers from the Florida Institute for Cybersecurity (FICS) at the University of Florida published this technical paper titled "FICS PCB X-ray: A dataset for automated printed circuit board inter-layers inspection." Abstract "Advancements in computer vision and machine learning breakthroughs over the years have paved the way for automated X-ray inspection (AXI) of printed circuit bo... » read more

Finding Wafer Defects Using Quantum DL
By Technical Paper Link - 13 Jun, 2022 - Comments: 0

New research paper titled "Semiconductor Defect Detection by Hybrid Classical-Quantum Deep Learning" by researchers at National Tsing Hua University. Abstract "With the rapid development of artificial intelligence and autonomous driving technology, the demand for semiconductors is projected to rise substantially. However, the massive expansion of semiconductor manufacturing and the develo... » read more

The Race To Zero Defects In Auto ICs
By Anne Meixner - 07 Jun, 2022 - Comments: 0

Assembly houses are fine-tuning their methodologies and processes for automotive ICs, optimizing everything from inspection and metrology to data management in order to prevent escapes and reduce the number of costly returns. Today, assembly defects account for between 12% and 15% of semiconductor customer returns in the automotive chip market. As component counts in vehicles climb from the ... » read more

Deep Learning In Industrial Inspection
By Ed Sperling - 24 May, 2022 - Comments: 0

Deep learning is at the upper end of AI complexity, sifting through more data to achieve more accurate results. Charlie Zhu, vice president of R&D at CyberOptics, talks about how DL can be utilized with inspection to identify defects in chips that are not discernible by traditional computer vision algorithms, classifying multiple objects simultaneously from multiple angles and taking into accou... » read more

Driving Toward More Rugged, Less Expensive SiC
By Katherine Derbyshire - 19 May, 2022 - Comments: 0

Silicon carbide is gaining traction in the power semiconductor market, particularly in electrified vehicles, but it's still too expensive for many applications. The reasons are well understood, but until recently SiC was largely a niche technology that didn't warrant the investment. Now, as demand grows for chips that can work in high-voltage applications, SiC is getting a much closer look. ... » read more

Compound Semiconductor Innovation Advances EVs And Other Green Technologies
By Rupa Velidandla - 11 May, 2022 - Comments: 0

As the world works to reduce greenhouse gas emissions, global adoption of electric vehicles (EVs) is driving an increased demand for high-power, energy-efficient compound semiconductors, such as silicon carbide (SiC)-based components, throughout the entire EV assembly process. Renewable energy technology is now at the forefront of climate-forward research, with accelerating EV sales playing�... » read more

Novel E-Beam Techniques For Inspection And Monitoring
By PDF Solutions - 09 May, 2022 - Comments: 0

In this paper, we report an advanced e-beam defect inspection tool (eProbe®250) and the Design-for-Inspection™ (DFI) system that has been built and deployed by PDF Solutions down to 4nm FinFET technology nodes. This tool has a very high throughput which allows for in-line inspection of nanometer-level defects in the most advanced technology nodes. We also present eProbe applications for... » read more

Nip The Defect In The Bud
By Melvin Lee - 12 Apr, 2022 - Comments: 0

As technology nodes shrink, end users are designing systems where each chip element is being targeted for a specific technology and manufacturing node. While designing chip functionality to address specific technology nodes optimizes a chip’s performance regarding that functionality, this performance comes at a cost: additional chips will need to be designed, developed, processed, and assembl... » read more

Case Study — 3D Wire Bond Inspection and Metrology
By CyberOptics - 12 Apr, 2022 - Comments: 0

The growing amount of electronics within modern vehicles has made the inspection process for wire bonds increasingly challenging, as active devices shrink and bonds are arranged in complex ways. CyberOptics addressed the need for an automated solution to replace labor-intensive and imprecise manual inspection methods for wire bonds and loop heights. After consideration of competitive products, ... » read more

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