Making Sure A Heterogeneous Design Will Work


An explosion of various types of processors and localized memories on a chip or in a package is making it much more difficult to verify and test these devices, and to sign off with confidence. In addition to timing and clock domain crossing issues, which are becoming much more difficult to deal with in complex chips, some of the new devices are including AI, machine learning or deep learning... » read more

AI Chip Architectures Race To The Edge


As machine-learning apps start showing up in endpoint devices and along the network edge of the IoT, the accelerators that make AI possible may look more like FPGA and SoC modules than current data-center-bound chips from Intel or Nvidia. Artificial intelligence and machine learning need powerful chips for computing answers (inference) from large data sets (training). Most AI chips—both tr... » read more

Getting Down To Business On Chiplets


Government agencies, industry groups and individual companies are beginning to rally around various chiplet models, setting the stage for complex chips that are quicker and cheaper to build using standardized interfaces and components. The idea of putting together different modules like LEGOs has been talked about for the better part of a decade. So far, only Marvell has used this concept co... » read more

Overcoming Gender Stereotypes In Tech


Gender inequality in the workplace is more complex and deep-rooted than most studies have shown, and efforts to address those issues are only scratching the surface. The problem runs deeper than just moving women into upper management. It extends all the way through organizations in ways that aren't always obvious. “I've been talking to senior women in engineering and junior women in en... » read more

Foundries Prepare For Battle At 22nm


After introducing new 22nm processes over the last year or two, foundries are gearing up the technology for production—and preparing for a showdown. GlobalFoundries, Intel, TSMC and UMC are developing and/or expanding their efforts at 22nm amid signs this node could generate substantial business for applications like automotive, IoT and wireless. But foundry customers face some tough choic... » read more

Week in Review: IoT, Security, Auto


Internet of Things Gartner identified what it says are the top 10 strategic Internet of Things technologies and trends. Number one, no surprise, is artificial intelligence. Nick Jones, research vice president at Gartner, said in a statement, “AI will be applied to a wide range of IoT information, including video, still images, speech, network traffic activity, and sensor data.” Other top t... » read more

EUV Mask Blank Battle Brewing


Amid the ramp of extreme ultraviolet (EUV) lithography in the market, suppliers of EUV mask blanks are expanding their production. And a new player—Applied Materials—is looking to enter the market. AGC and Hoya, the two main suppliers of EUV mask blanks, are adding capacity for these critical components that are used for EUV photomasks. A mask blank serves as the substrate for a photomas... » read more

Smart Manufacturing Initiative


SEMI’s Smart Manufacturing (SM) Initiative has been a gathering place for companies who believe that electronics manufacturing will benefit from the gathering and analysis of production and sensor data, and optimizing processes based on that data. SM principles are focused on increasing speed, improved output and higher quality. Smart Manufacturing relies on simplifying data sharing and co... » read more

Multi-Beam Mask Writing Finally Comes Of Age


Elmar Platzgummer, chief executive of IMS Nanofabrication, sat down with Semiconductor Engineering to discuss photomask and mask writing trends. IMS, a subsidiary of Intel, is a supplier of multi-beam e-beam systems for photomask production. What follows are excerpts of that conversation. SE: For years, photomask makers have used single-beam e-beam tools to pattern or write the features on ... » read more

Week In Review: Manufacturing, Test


Trade SEMI has voiced support and encouragement for trade discussions between U.S. President Donald Trump and the People's Republic of China President Xi Jinping. The talks are planned for Dec. 1 during the G20 Summit in Argentina. SEMI expressed hope for a deal and offered principles beneficial to the microelectronics supply chain. Recent tariffs and trade tensions, on top of rumored expor... » read more

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