tag: Intel

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 15 Feb, 2019 - Comments: 0

Internet of Things Is Google developing a Pixel Watch wearable? Perhaps, if recent job listings are any indication. The company recently was looking to hire someone as vice president of hardware engineering, wearables. Last month, Fossil Group sold smartwatch technology intellectual property to Google for $40 million, while Google hired certain members of Fossil’s wearables R&D team. ... » read more

MEMS & Sensors Technical Congress Focuses on Automotive, Emerging MEMS
By Heidi Hoffman - 08 Feb, 2019 - Comments: 0

This year’s MEMS & Sensors Technical Congress (MSTC), February 19-20, 2019, features a deep dive into the changing automotive sensor landscape, a look at emerging MEMS technologies, and an exploration of integration standards. The more technically focused of SEMI’s annual MEMS events, MSTC returns to Monterey, California, in conjunction with FLEX, the conference that highlights new form... » read more

The Race To Multi-Domain SoCs
By Ed Sperling - 07 Feb, 2019 - Comments: 0

K. Charles Janac, president and CEO of Arteris IP, sat down with Semiconductor Engineering to discuss the impact of automotive and AI on chip design. What follows are excerpts of that conversation. SE: What do you see as the biggest changes over the next 12 to 24 months? Janac: There are segments of the semiconductor market that are shrinking, such as DTV and simple IoT. Others are going ... » read more

Blog Review: Feb. 6
By Jesse Allen - 06 Feb, 2019 - Comments: 0

Mentor's Harry Foster examines the impact of growing design complexity on how long designs spend in verification, the ratio of design to verification engineers on a project, and how they spend their time. Cadence's Paul McLellan checks out some of the emerging memory technologies and notes there's no clear indication which will dominate the market. Synopsys' Meenakshy Ramachandran checks ... » read more

Manufacturing Bits: Feb. 5
By Mark LaPedus - 05 Feb, 2019 - Comments: 1

Multi-beam litho shakeout The multi-beam e-beam market for lithography applications continues to undergo a shakeout amid technical roadblocks and other issues. Last week, ASML announced that it had acquired the intellectual-property (IP) assets of Mapper Lithography, a Dutch supplier of multi-beam e-beam tools for lithography applications that fell into bankruptcy late last year. As it t... » read more

Week In Review: Design, Low Power
By Jesse Allen - 01 Feb, 2019 - Comments: 0

Tools & IP OneSpin revealed its latest formal app, Connectivity XL, providing formal connectivity checking to 7nm, multi-billion gate SoC designs. The app generates detailed connectivity specification tables from abstract connectivity specs through a dedicated checking engine that integrates structural and formal analysis to perform on-the-fly, automated abstractions. It supports verificat... » read more

Clock Domain Crossings in the FPGA World
By Aldec - 30 Jan, 2019 - Comments: 0

Clock domain crossing (CDC) issues cause significant amount of failures in ASIC and FPGA devices. As FPGA complexity and performance grows, the influence of CDC issues on design functionality grows even more. This paper outlines CDC issues and their solutions for FPGA designs. Various design techniques are presented together with real-life examples for Xilinx and Intel FPGA devices. More import... » read more

Blog Review: Jan. 30
By Jesse Allen - 30 Jan, 2019 - Comments: 0

Cadence's Paul McLellan provides a primer on embedded memory types, their tradeoffs, and the emerging technologies to keep an eye on. Mentor's Matthew Ballance takes a look at how Portable Stimulus can help create better virtual sequences. Synopsys' Taylor Armerding takes a look at what the next year holds for open source, from changes in license terms to the impact of GDPR and a broader ... » read more

China’s Foundry Biz Takes Big Leap Forward
By Mark LaPedus - 28 Jan, 2019 - Comments: 1

China continues to advance its foundry industry with huge investments in new fabs and technology, despite trade tensions and a slowdown in the IC market. China has the most fab projects in the world, with 30 new facilities or lines in construction or on the drawing board, according to data from SEMI’s World Fab Forecast Report. Of those, 13 fabs are targeted for the foundry market, accordi... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 25 Jan, 2019 - Comments: 0

Chipmakers Shares of Intel fell amid lackluster results for the company, according to a report from CNBC. But Intel is also boosting its capital spending to $15.5 billion, according to the report. Here’s more on Intel from PC World. Meanwhile, Intel is expanding its research fab in Oregon, dubbed D1X, according to a report from The Oregonian. The company is in the process of building an ... » read more

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