tag: Intel

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 16 Nov, 2018 - Comments: 0

Internet of Things Gartner identified what it says are the top 10 strategic Internet of Things technologies and trends. Number one, no surprise, is artificial intelligence. Nick Jones, research vice president at Gartner, said in a statement, “AI will be applied to a wide range of IoT information, including video, still images, speech, network traffic activity, and sensor data.” Other top t... » read more

EUV Mask Blank Battle Brewing
By Mark LaPedus - 15 Nov, 2018 - Comments: 2

Amid the ramp of extreme ultraviolet (EUV) lithography in the market, suppliers of EUV mask blanks are expanding their production. And a new player—Applied Materials—is looking to enter the market. AGC and Hoya, the two main suppliers of EUV mask blanks, are adding capacity for these critical components that are used for EUV photomasks. A mask blank serves as the substrate for a photomas... » read more

Smart Manufacturing Initiative
By Ayo Kajopaiye - 15 Nov, 2018 - Comments: 0

SEMI’s Smart Manufacturing (SM) Initiative has been a gathering place for companies who believe that electronics manufacturing will benefit from the gathering and analysis of production and sensor data, and optimizing processes based on that data. SM principles are focused on increasing speed, improved output and higher quality. Smart Manufacturing relies on simplifying data sharing and co... » read more

Multi-Beam Mask Writing Finally Comes Of Age
By Mark LaPedus - 15 Nov, 2018 - Comments: 0

Elmar Platzgummer, chief executive of IMS Nanofabrication, sat down with Semiconductor Engineering to discuss photomask and mask writing trends. IMS, a subsidiary of Intel, is a supplier of multi-beam e-beam systems for photomask production. What follows are excerpts of that conversation. SE: For years, photomask makers have used single-beam e-beam tools to pattern or write the features on ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 09 Nov, 2018 - Comments: 0

Trade SEMI has voiced support and encouragement for trade discussions between U.S. President Donald Trump and the People's Republic of China President Xi Jinping. The talks are planned for Dec. 1 during the G20 Summit in Argentina. SEMI expressed hope for a deal and offered principles beneficial to the microelectronics supply chain. Recent tariffs and trade tensions, on top of rumored expor... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 09 Nov, 2018 - Comments: 0

Internet of Things What’s better than a 5G network? How about a local, private 5G network? The Industrial Internet of Things may drive the development of such networks. Of course, 5G cellular communications technology is still being worked out worldwide. BMW, Daimler, and Volkswagen are looking ahead to the future; those automotive manufacturers notified Germany’s Federal Network Agency th... » read more

Blog Review: Nov. 7
By Jesse Allen - 07 Nov, 2018 - Comments: 0

Arm's Shidhartha Das looks into maximizing the benefits of power delivery networks and explains a non-intrusive technique using an on-chip digital storage oscilloscope that can directly sample the power-rails to probe potential runtime bugs due to power delivery weaknesses. Synopsys' Snigdha Dua argues that scrambling is one of the most important features introduced in HDMI 2.0 and takes a l... » read more

Panel Fan-out Ramps, Challenges Remain
By Mark LaPedus - 05 Nov, 2018 - Comments: 0

After years of R&D, panel-level fan-out packaging is finally beginning to ramp up in the market, at least in limited volumes for a few vendors. However, panel-level fan-out, which is an advanced form of today’s fan-out packaging, still faces several technical and cost challenges to bring this technology into the mainstream or high-volume manufacturing. Moreover, several companies are d... » read more

Blog Review: Oct. 31
By Jesse Allen - 31 Oct, 2018 - Comments: 0

Mentor's Joe Hupcey III digs into handling memories effectively with formal through abstraction and the easiest ways to address memory-related inconclusive results. Cadence's Paul McLellan explains DARPA's CHIPS program that aims to lower semiconductor design costs through chiplet-based designs, the current status of the work, and what the next steps will be. Synopsys' Sangeeta Kulkarni c... » read more

The Impact of Moore’s Law Ending
By Brian Bailey - 29 Oct, 2018 - Comments: 2

Over the past couple of process nodes the chip industry has come to grips with the fact that Moore's Law is slowing down or ending for many market segments. What isn't clear is what comes next, because even if chipmakers stay at older nodes they will face a series of new challenges that will drive up costs and increase design complexity. Chip design has faced a number of hurdles just to get ... » read more

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