Meeting The USB IP Requirements Of SoC Designs From 180-nm To 14/16nm FinFET


The ubiquitous USB standard provides data and charging capabilities to a multitude of consumer and enterprise products. USB’s ease-of-use and wide availability is belied by USB IP designers’ technical innovations. Without these innovations, USB could not be enabled in a broad range of process technologies ranging from 180-nm to the latest 14/16-nm FinFET technologies. This white paper ad... » read more

The Week In Review: Design


IP ARM introduced a new software platform and a free operating system aimed at IoT development. The OS incorporates security, communication and device management features for improved energy efficiency. The device server simplifies the connection and management of devices, incorporating security and improving efficiency. Cadence rolled out a broad IP portfolio for TSMC's 16nm platform, and ... » read more

More Than Moore


Semiconductor Engineering sat down to discuss the value of feature shrinks and what comes next with Steve Eplett, design technology and automation manager at [getentity id="22664" e_name="Open-Silicon"]; Patrick Soheili, vice president and general manager of IP Solutions at [getentity id="22242" e_name="eSilicon"]; Brandon Wang, engineering group director at [getentity id="22032" e_name="Cadenc... » read more

Tech Talk: IP Integration


Sonics CTO Drew Wingard talks about the challenges of integrating IP into SoCs and what typically goes wrong. [youtube vid=T1FAPDqIJK8] » read more

The Real Numbers: Redefining NRE


Developing ICs at the most advanced nodes is getting more expensive, but exactly how much more expensive is the subject of debate across the semiconductor industry. There are a number of reasons for this discrepancy. Among them: As design flows shift from serial to parallel, it's hard to determine which groups within companies should be saddled with different portions of the bill. The re... » read more

Challenges Increase for IP At Advanced Nodes


At advanced process nodes such as 16/14/10nm, designing [getkc id="43" comment="IP"] is a much tougher nut to crack due to complexity and other considerations, not to mention then trying to migrate and/or re-use that IP. Still, engineering teams are looking for leverage wherever they can find it in their designs amid the technical challenges to overcome. Tomasz Wojcicki, vice president of c... » read more

Evaluation Platforms Key To Complex IP Integration


Just because a chip is complex to build doesn’t mean it has to take a long time. Runaway complexity in SoC and ASIC design is forcing chip companies to consider different methodologies and approaches that could actually simplify and speed up the whole process. The first step in this process was commercial IP, and its growing popularity attests to the fact that chipmakers are looking for... » read more

Time To Market Concerns Worsen


Time to market has always been an issue for chipmakers in highly competitive sectors, but as complexity of chips continues to grow at advanced nodes, and as markets shift increasingly toward consumer electronics, it has jumped to the No. 1 concern. Interviews with engineers at multiple levels inside of some of the largest and midsize chipmakers, conducted by Semiconductor Engineering over th... » read more

Quantifying IP Entitlement For 14/16nm Technologies


The scaling benefits of [getkc id="74" comment="Moore"s Law"] are being seriously tested at 28nm. It is no longer a given that the cost per gate will go down at leading edge process nodes below 28nm, e.g., 20nm though 14nm. Rising design and manufacturing costs are contributing factors to this trend. Meanwhile, the competing trend of fewer but more complex [getkc id="81" comment="SoC"] (So... » read more

High Throughput GSPS Signal Processing For FPGAs And ASICs Using Synthesizable IP Cores


This whitepaper illustrates how parallel processing synthesizable [getkc id="43" comment="IP"] cores available in Synphony Model Compiler enable Giga Samples Per Second (GSPS) throughput on FPGAs, and efficient area/power trade-offs for ASIC targets. In particular, we demonstrate how Parallel FFT, FIR, and CIC blocks enable users to scale throughput beyond achievable clock frequencies, and/or r... » read more

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