Why Cyberattacks Will Be No Match For Autonomous Vehicles

By Marc Canel - 28 May, 2020 - Comments: 0

Malware, ransomware, viruses, denial-of-service attacks – these threats can leave a business reeling as it struggles to recover. Others might not recover at all, but that hasn’t stopped most industries from treating cybersecurity as an afterthought. Unfortunately, this is how it has been handled since the first hackers emerged. It’s only when a company is hit that other players start to r... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 22 May, 2020 - Comments: 0

Edge, cloud, data center Cadence added new verification IP (VIP) for hyperscalar data centers that supports CXL – Compute Express Link, HBM3, and Ethernet 802.3ck. The VIP are part of Cadence’s Verification Suite. Cadence also released IP for 56G long-reach SerDes on TSMC’s N7 and N6 process technologies. Many Mentor, a Siemens Business, IC design tools are now certified TSMC’s N5 a... » read more

Sensors, Data And Machine Learning

By Ed Sperling - 12 May, 2020 - Comments: 0

Strategies for building reliability into chips and systems are beginning to shift as more sensors are added into these devices and machine learning is applied to that data. In the past, system monitoring relied heavily on MEMS devices for things like acceleration, temperature and positioning (gyroscopes). While those devices are still important, in the past couple years there has been an exp... » read more

Sensing Automotive IC Failures

By Anne Meixner - 12 May, 2020 - Comments: 1

The sooner you detect a failure in any electronic system, the sooner you can act. Together, data analytics and on-chip sensors are poised to boost quality in auto chips and add a growing level of predictive maintenance for vehicles. The ballooning number of chips cars makes it difficult to reach 10 defective parts per billion for every IC that goes into a car. And requiring that for a 15-y... » read more

IC Test Solutions For The Automotive Market

By Mentor, a Siemens Business - 06 May, 2020 - Comments: 0

The amount of electronic content in passenger cars continues to grow rapidly, driven mainly by the integration of various advanced safety features, which will increase further with the move towards fully autonomous vehicles. It is critical that these safety-related devices adhere to the highest possible quality and reliability requirements formalized in the ISO 26262 standard that is being rapi... » read more

Power-Hungry Safety And Security

By Brian Bailey - 09 Apr, 2020 - Comments: 0

There is a price to pay for everything. When it comes to adding safety and security into a device, the costs in terms of power and area can be significant, but if the task is taken seriously, those costs can be managed and minimized. New analysis and implementation tools are coming to market that can also help to keep the costs contained. But it also requires the right mindset. As more indus... » read more

Reliability Challenges Grow For 5/3nm

By Ed Sperling And Susan Rambo - 07 Apr, 2020 - Comments: 0

Ensuring that chips will be reliable at 5nm and 3nm is becoming more difficult due to the introduction of new materials, new transistor structures, and the projected use of these chips in safety- and mission-critical applications. Each of these elements adds its own set of challenges, but they are being compounded by the fact that many of these chips will end up in advanced packages or modul... » read more

The Need For Traceability In Auto Chips

By Anne Meixner - 07 Apr, 2020 - Comments: 4

Someday your car will drive itself to a repair shop for a recall using a scheduling application that is both efficient and can prioritize which vehicles need to be fixed first. But that's still a ways off. Proactive identification of issues is not yet available. To be ready for that, today’s data analytics systems need to begin supporting targeted recalls, enabling predictive maintenance a... » read more

Four Steps To ISO 26262 Safety Mechanism Insertion And Validation

By Ping Yeung - 02 Apr, 2020 - Comments: 1

By Ping Yeung, Jin Hou, Vinayak Desai, and Jacob Wiltgen The complexity of automotive integrated circuits (ICs) has grown exponentially with the introduction of advanced driver-assistance systems and autonomous-drive technologies. Directly correlated to this hike in complexity is the increased burden of ensuring an IC is protected from random hardware faults—functional failures that occur ... » read more

Tracking Automotive’s Rapidly Shifting Ecosystem

By Ann Mutschler - 02 Apr, 2020 - Comments: 0

The automotive ecosystem is becoming much harder to navigate as automakers, Tier 1s and IP vendors redefine their relationships based upon shifting value caused by an rapidly expanding amount of increasingly interdependent and complex electronic content. Predictions of massive change started almost a decade ago with a number of pilot programs around autonomous vehicles. But those shifts real... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: ISO 26262