The Uncontrolled Rise Of Functional Safety Standards


Over the past 30 years, advances in software and hardware have made it possible to create sophisticated systems controlling crucial aspects of complex equipment, from rolling and pitching in aircrafts, to steering and braking in cars. The processes and methods defined in functional safety standards are crucial to ensure that these systems behave as expected and safely, even when certain parts �... » read more

Understanding How To Assess Tool Confidence Levels For ISO 26262


ISO 26262, the automotive functional safety standard, requires the assessment of software Tool Confidence Levels (TCLs). Some SoC designers are under the impression that all tools must be classified with a TCL1. In reality, the goal is to classify your tools accurately for your specific situation and use case. This white paper provides insight on assessing TCLs that are consistent with ISO 2626... » read more

For SoC ISO 26262 Compliance, Should All EDA Tools Be TCL1?


ISO 26262, the automotive functional safety standard, requires the assessment of software tool confidence levels (TCLs) as either a TCL1, TCL2 or TCL3.  Part 8:2011, clause 11.4.5 of the ISO 26262 standard provides a methodology with guidance for software tool classification and qualification. It applies to software tools used for the development of safety-critical designs where it is essentia... » read more

Look Ma, No Hands! Functional Safety From The Driver’s Seat


Every so often, I undertake a project that reminds me why I love working in semiconductor marketing. Back in August, I hopped behind the wheel of a Tesla Model X to film a video for OneSpin about how formal verification can help designers to satisfy the ISO 26262 automotive safety standard. If you haven't yet seen the video, you can watch it here: http://bit.ly/2ycK5Yp The Model X itself was... » read more

The Week In Review: Design


Storage Western Digital uncorked disk drives based upon microwave-assisted magnetic recording technology. MAMR technology is one of two energy-assisted technologies the company has under development, the other being heat-assisted magnetic recording. Of the two, Western Digital said only MAMR has achieved the reliability required in data centers. The company noted that densities of its MAMR dev... » read more

Achieving ISO 26262 Certification With ASIL-Ready IP


According to an article by McKinsey, “analysts predict revenue growth for advanced driver assistance systems (ADAS) to be up to 29 percent, giving the segment one of the highest growth rates in the automotive and related industries.” This opportunity has invigorated the automotive supply chain to increase their R&D investments for faster product innovations. The focus on innovation is e... » read more

Tech Talk: Embedded Flash For Cars


Wei Cong, director of product engineering at Kilopass, talks with Semiconductor Engineering about one-time programmable embedded memory in automotive applications and why it is becoming essential for driver-assisted and autonomous vehicles. https://youtu.be/R_3DHWpxiKc » read more

DVCon Europe Takes Over Munich October 16-17


DVCon Europe is on the horizon, and this year's program should prove to be very timely. Chips and systems are getting more complex, verification is becoming more difficult, and formal has emerged as a critical piece of the verification suite The lineup this year tackles some key issues facing a changing semiconductor landscape. During a Monday tutorial, “Next Generation ISO 26262-based De... » read more

Functional Safety For FPGA-Based Hardware Designs


Advances in design and manufacturing technology allow increased factory automation, where tasks are automatically performed by sophisticated equipment such as industrial robots. Manufacturing processes require fail-safe mechanisms to prevent human injury or costly downtime. With increasing sophistication and automation of the manufacturing processes, there is increasing need for error detection... » read more

Executive Insight: Lip-Bu Tan


Semiconductor Engineering sat down with Lip-Bu Tan, president and CEO of [getentity id="22032" e_name="Cadence"], to discuss disruptions and changes in the semiconductor industry, from machine learning and advance packaging to tools and business. What follows are excerpts of that conversation. SE: What do you see as the next big thing? Tan: Unlike mobility or cell phones, or PCs before th... » read more

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