Anatomy Of A System Simulation


The semiconductor industry has greatly simplified analysis by consolidating around a small number of models and abstractions, but that capability is breaking down both at the implementation level and at the system level. Today, the biggest pressure is coming from the systems industry, where the electronic content is a small fraction of what must be integrated together. Systems companies tend... » read more

Rethinking Design, Workflow For 3D


In the 3D world, where NAND has hundreds of layers and packages come in intricate stacks, fresh graduates and veteran engineers alike are being confronted with design challenges that require a rethinking of both classic designs and traditional workflows, but without breaking the laws of physics. “There are pockets of things that have been on 3D for quite some time,” said Kenneth Larson, ... » read more

Making Connections In 3D Heterogeneous Integration


Activity around 3D heterogeneous integration (3DHI) is heating up, driven by growing support from governments, the need to add more features and compute elements into systems, and a widespread recognition that there are better paths forward than packing everything into a single SoC at the same process node. The leading edge of chip design has changed dramatically over the last few years. Int... » read more

Powering Up Electric Heavy-Duty Vehicles


Smokey tailpipe emissions may soon be a thing of the past, as the heavy transport vehicle market catches up with the electric car market to lower their contribution to greenhouse gas (GHG) emissions. Private sedans and light-duty trucks lead the vehicle electrification race, leaving much upside opportunity for heavy transport fleets such as trucks and buses to catch up. In the United Stat... » read more

Five Strategies To Accelerate 5G Device Development


Designing and implementing 5G devices in new mmWave operating bands present new challenges. New technologies and evolving standards increase design complexity. Here are five strategies to help you address these challenges and get your designs to market faster. Click here to read more. » read more

Blog Review: October 25


Synopsys’ Graham Allan looks at enhancements in the LPDDR5X standard, such as a speed increase from 6.4Gbps to 8.5Gbps using the same 1.1V core voltage as LPDDR5 alongside better signal integrity, reliability, and battery efficiency. Cadence’s Krunal Patel examines the essential components and operation of MACsec, a security protocol to ensure the confidentiality and integrity of data tr... » read more

Memory And High-Speed Digital Design


As DRAM gets faster, timing constraints, jitter, and signal integrity become harder to control. The real challenge is to understand what can go wrong early in the design process, and that becomes more complex with each new version of memory and higher signal speeds. Stephen Slater, product manager for EDA products at Keysight, talks about how simulation can be applied to these issues, what to t... » read more

Blog Review: October 18


Siemens' Stephen Chavez suggests including analog mixed signal analysis and board level parasitics within the design process from the earliest electrical design stage and throughout final release of the PCB design. Synopsys’ Filip Thoen, Leonard Drucker, and Vivek Prasad highlight how the complexities and interdependencies of multi-die systems create new challenges for software bring-up, a... » read more

Chip Industry Talent Shortage Drives Academic Partnerships


Universities around the world are forming partnerships with semiconductor companies and governments to help fill open and future positions, to keep curricula current and relevant, and to update and expand skills for working engineers. Talent shortages repeatedly have been cited as the number one challenge for the chip industry. Behind those concerns are several key drivers, and many more dom... » read more

Wireless Technology Insights: Navigating The Evolution From 5G To 6G


As 5G evolution advances, developments like the open radio access network (O-RAN) ecosystem, non-terrestrial network (NTN) infrastructure, and 5G reduced capability (RedCap) devices continue to gain momentum. Though 5G implementation is still underway, the wireless communication industry is already preparing for next-generation 6G wireless technology. With so much development happeni... » read more

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