Blog Review: May 14


Siemens’ Stephen V. Chavez finds that proper PCB high voltage spacing between conductive elements is key to reliability and understanding the principles of clearance (through-air spacing) and creepage (along-surface spacing) is critical. Cadence’s Frank Ferro checks out how the new HBM4 standard boosts bandwidth and addresses key issues in the data center, including the growing size of L... » read more

Chip Industry Week in Review


Check out the Inside Chips podcast for our behind-the-scenes analysis. The U.S. government is rescinding a Biden-era AI export rule that would have imposed complex restrictions on how U.S. chip and AI technology is sold abroad, a move welcomed by companies like Nvidia, reports Bloomberg. While new, simpler guidelines are expected in the coming months, the decision introduces short-term uncer... » read more

Blog Review: May 7


Cadence’s Mayank Bhatnagar examines the challenge of ensuring the functional safety of disaggregated designs and how UCIe can serve as a certified way to connect individual components. Siemens’ Charlie Olson explores the causes of inter-domain leakage when a DC path is formed between two power rails and how to overcome the limitations of traditional electrical rule checking. Synopsys�... » read more

Chip Industry Week in Review


Check out the Inside Chips podcast for our behind-the-scenes analysis of changes at Intel Foundry. Intel rolled out its updated process technology roadmap this week, along with early process design kit (PDK) for its 14A gate-all-around process technology. That node will utilize high-NA EUV, and include direct contact power delivery, the second generation of its backside power delivery techno... » read more

Blog Review: Apr. 30


Cadence’s Sree Parvathy points out how electrothermal analysis can help designers understand how temperature changes affect device behavior, such as mobility, threshold voltage, and saturation to mitigate potential failures due to thermal overstress. In a podcast, Siemens’ Conor Peick, Dale Tutt, and Mike Ellow chat about the transition towards software-defined products and why companies... » read more

What Is Electronic Design Automation And Why Do You Need It?


As data speeds push into the multi-gigabit range and requirements on digital systems grow more complex, cutting down the time-to-market while also ensuring error-free reliable designs seems impossible. Traditional design tools and practices can result in failed prototypes, costly respins, delayed time-to-market, missed market opportunities, and subpar performance. This is why advanced EDA to... » read more

Modeling Flux-Quantizing Josephson Junction Circuits


We introduce Josephson junction and inductor models in Keysight ADS that feature an auxiliary flux port, and facilitate the expression of flux quantization conditions in simulation of superconducting microwave circuits. We present several examples that illustrate our methodology for constructing flux-quantizing circuits, including dc- and rf-SQUIDs, tunable couplers, and parametric amplifiers u... » read more

Blog Review: Apr. 16


Siemens’ Tova Levy finds that heterogeneous integration necessitates a shift to a system-level technology co-optimization approach where power, performance, area, cost, and reliability are considered across various components, including silicon, package, interposer, and PCB. Synopsys’ Greg Sorber listens in as Arm’s Rene Haas and Synopsys’ Sassine Ghazi discuss the opportunity for AI... » read more

Chip Industry Week In Review


Don't have time to read this? Check out Semiconductor Engineering's Inside Chips podcast.  The U.S. Department of Commerce is investigating TSMC for potential export control violations involving Huawei chips, reports Reuters. The probe follows TechInsights' teardown of a Huawei AI accelerator chip last year. The foundry, meanwhile, maintains it has not shipped any chips to Huawei since 2020... » read more

Chip Industry Week In Review


Check out our new Inside Chips podcast. President Trump’s ‘Liberation Day’ tariffs were announced this week. The executive order stated that semiconductors and copper imports are not directly subject to the reciprocal tariff, although the exemption may be short-lived. Semiconductor equipment and tools were not mentioned, leaving the industry searching for clarification. Regardless, hig... » read more

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