tag: Keysight

Week In Review: Design, Low Power
By Jesse Allen - 04 Aug, 2023 - Comments: 0

Qualcomm, NXP, Infineon, Nordic, and Bosch are jointly investing in a new RISC-V company, to be formed in Germany, that will speed up RISC-V’s adoption in commercial products. The company will be “a single source to enable compatible RISC-V based products, provide reference architectures, and help establish solutions widely used in the industry,” according to a press release. The co... » read more

Multiple Hurdles In The Race To 6G
By John Koon - 03 Aug, 2023 - Comments: 0

The rollout of 6G will open the door to significant changes and possibilities, but whether this technology lives up to the hype will require massive collaborative efforts, huge investments in infrastructure, and solving some problems for which there are no precedents. Multiple companies are already working on 6G technology, aiming for a maximum download speed of one terabit per second (Tb/s)... » read more

Blog Review: Aug. 2
By Jesse Allen - 02 Aug, 2023 - Comments: 0

Siemens' Katie Tormala points to the need for die attach thermal testing to ensure efficient removal of heat dissipation from power electronics components to prevent premature failure or thermal runaway. Synopsys's Dermott Lynch notes that over 30% of semiconductor failures are attributed to electrostatic discharge, with damage ranging from leakages and shorts to junction and metallization b... » read more

Solving 5G And 6G Challenges With Artificial Intelligence
By Sarah LaSelva - 27 Jul, 2023 - Comments: 0

Wireless networks are inherently complex, generate massive amounts of data, and have grown in complexity with each new generation of technology. This combination of large data sets and complexity makes wireless networks an ideal candidate for AI. People are receiving first-hand experiences of the power and potential of deep neural networks and machine learning (ML) as the technology begins t... » read more

How To Boost ATE Power Supply Throughput
By Keysight - 26 Jul, 2023 - Comments: 0

The test engineer’s job is not an easy one. There is constant pressure to improve system throughput. This white paper will guide you on how to increase throughput to reduce costs. Increased throughput comes from faster programming and command processing times, built-in output sequencing, and arbitrary waveform capabilities. Faster testing speeds will enable more rigorous testing of devices, d... » read more

Blog Review: July 26
By Jesse Allen - 26 Jul, 2023 - Comments: 0

Siemens' Chris Spear shows how to make a group of specialized classes in SystemVerilog. Synopsys' Guy Cortez and Randy Fish consider what a silicon lifecycle management strategy looks like for SoCs deployed in HPC and data center environments. Cadence's Veena Parthan provides a primer on writing Python scripts for Fidelity, including API descriptions and different sets of packages to acce... » read more

Getting Rid Of Heat In Chips
By Brian Bailey - 20 Jul, 2023 - Comments: 1

Power consumed by semiconductors creates heat, which must be removed from the device, but how to do this efficiently is a growing challenge. Heat is the waste product of semiconductors. It is produced when power is dissipated in devices and along wires. Power is consumed when devices switch, meaning that it is dependent upon activity, and that power is constantly being wasted by imperfect de... » read more

Blog Review: July 19
By Jesse Allen - 19 Jul, 2023 - Comments: 0

Siemens' Keith Felton argues that co-design-driven semiconductor package planning and prototyping is critical for design success and points to how interchange formats enable designers to make trade-off decisions for both the package and the board and communicate those recommendations back to the other design team in formats that are native to their tools. Cadence's Xin Mu explains precoding ... » read more

Week In Review: Design, Low Power
By Susan Rambo - 14 Jul, 2023 - Comments: 0

DAC and SEMICON WEST rebounded this year, focusing on everything from security to chiplets and smart manufacturing. Panel at DAC conference: Left to right, ARM’s Brian Fuller (moderator), Joe Costello (Metrics, Kwikbit, Arrikto, Acromove), and Wally Rhines (Cornami). Source: Semiconductor Engineering/Ann Mutschler EDA and IP remain strong, approaching $4 billion in Q1, according to ... » read more

Curbing Automotive Cybersecurity Attacks
By John Koon - 06 Jul, 2023 - Comments: 1

The relentless cyberattacks on the automotive sector are not limited to vehicles and have an impact on the entire automotive supply chain, so the pressure is on the automotive ecosystem to understand the necessary standards and regulations for vehicles and components. While the process of attaining compliance adds additional effort, in the long run, the increase in cybersecurity will save the a... » read more

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