The Next Big Threat: Manufacturing

By Ed Sperling - 23 Jan, 2014 - Comments: 0

The business adage that you’re only as good as your partners should be a core principle of doing business when it comes to security. But with a complex SoC you don’t always know all your partners, who financed them—or worse, who else they’re working with or working for. Consider this scenario: A band of sophisticated thieves grinds off the top of an SoC package, inserts probes to map... » read more

Industry Restructures Around Cost

By Ed Sperling - 19 Dec, 2013 - Comments: 1

Talk to any semiconductor executive these days about what’s next for their company and you’ll probably encounter the same perspective—cost will drive future design decisions. Dig a little further, however, and you’ll find no consistent strategy for reducing that cost. While the industry has three very viable solutions for improving the power and performance characteristics of SoCs—... » read more

Even Standard IP Isn’t Always Standard

By Ed Sperling - 21 Nov, 2013 - Comments: 0

Time to market and rising complexity are forcing the use of more third-party IP as well as increasing reuse of internally developed IP. But as more IP is added into SoCs, chipmakers are discovering some interesting things: Not all IP works together as planned, even when it’s well characterized. As with cars, performance and mileage vary greatly depending upon who’s driving—and who’s... » read more

Uncertainty Increases About What’s Next

By Ed Sperling - 24 Oct, 2013 - Comments: 0

Across the semiconductor industry, there is a lot of talk about what’s next. Lithography advances have stalled, NRE and mask costs are rising, and complexity is exploding. But unlike the 1 micron wall, which was supposed to be impenetrable, there is no single issue holding back progress. Instead, there are lots of them, most with pricey workarounds, but which together become more complicat... » read more

Buying And Selling EDA Companies

By Ed Sperling - 24 Oct, 2013 - Comments: 0

EDA, arguably more than any other industry, has been built on the backs of engineering breakthroughs by startups. In aggregate, those startups are the backbone of tools that have made cell phones smart and which helped improved gas mileage on automobiles. Through an almost continuous stream of acquisitions, these startups have added to the top-line valuation of big EDA companies, and despite th... » read more

A Case Study: How A Call For SOS Improved Designer Productivity

By Various Writers - 24 Oct, 2013 - Comments: 0

Authors: Andrey Medushevskiy, CAD/PDK Manager; Konstantin Bragin, ASIC Verification Lead; Michail Kakoulin, Head IC Design Centre Milandr Moscow, Russia Milandr is a twenty-year-old product company based in Moscow, Russia, that builds high-reliability integrated circuit (IC) products for the aerospace, avionics, automotive, and consumer markets. Their product lines include microcontrollers... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?