tag: KLA-Tencor

Manufacturing Bits: Feb. 24
By Mark LaPedus - 24 Feb, 2015 - Comments: 0

EUV progress report At the SPIE Advanced Lithography conference in San Jose, Calif., ASML Holding said that one customer, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), has exposed more than 1,000 wafers on an NXE:3300B EUV system in a single day. This is one step towards the insertion of EUV lithography in volume production. During a recent test run on the system, TSMC exposed 1,022 w... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 20 Feb, 2015 - Comments: 0

For years, chipmakers have attempted to build fabs in India. So far, however, India has failed to set up modern fabs and for good reason. There are issues in terms of obtaining dependable power and water for a fab in India, according to Will Strauss, president of Forward Concepts, who added that India also suffers from government bureaucracy. India is still trying. Last week, Cricket Semicon... » read more

Counting And Controlling DSA Defects
By Katherine Derbyshire - 13 Nov, 2014 - Comments: 1

If directed self-assembly is to succeed in semiconductor manufacturing, [gettech id="31046" t_name="DSA"] processes must achieve defect rates in line with the stringent requirements of sub-20nm device nodes. So far, they haven’t. However, it’s not yet clear whether the high defect rates represent a real obstacle, or are simply part of the development of any new, immature process technology... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 03 Oct, 2014 - Comments: 0

Jimmy Kimmel, comedian and late night host of Jimmy Kimmel Live, replaces Lily Collins (Mirror, Mirror) as McAfee’s most dangerous celebrity to search for online. Cybercriminals are looking for ways to take advantage of consumer interest around popular cultural events. These criminals capitalize on the public’s fascination with celebrities to lure them to sites laden with malware, which ena... » read more

Wanted: Multi-beam E-Beam Inspection
By Mark LaPedus - 18 Sep, 2014 - Comments: 0

The IC industry is making a giant leap from planar devices to a range of next-generation architectures, such as 3D NAND and finFETs. But it’s taking longer than expected to ramp up these new technologies in the market. And the challenges are expected to mount for the next round of chips. It’s difficult to pinpoint the exact issues with 3D NAND and finFETs. On the manufacturing front alo... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 25 Jul, 2014 - Comments: 0

Here’s a sad commentary on the state of Japan’s electronics industry: Some Japanese electronics giants are converting unused factories and fabs into agricultural growing facilities, according to The Wall Street Journal. Last month, for example, Fujitsu began selling lettuce from the Aizu-Wakamatsu plant. It's officially over. IBM's talks to sell its chip unit to GlobalFoundries have offi... » read more

Has 3D NAND Fallen Flat?
By Mark LaPedus - 17 Jul, 2014 - Comments: 0

Today’s planar NAND technology will hit the wall at 10nm, prompting the need for the next big thing in flash memory—3D NAND. In fact, 3D NAND may extend NAND flash memory for the next several years and enable new applications. And it will also drive a new wave of fabs and tool orders. But the transition won’t be as smooth as previous rollouts. 3D NAND is harder to manufacture than pr... » read more

What Happened To 450mm?
By The SE Staff - 17 Jul, 2014 - Comments: 1

By Mark LaPedus, Ed Sperling & Katherine Derbyshire There was a time not very long ago—one process node, in fact—when the economic momentum of Moore’s Law seemed unstoppable with a combination of extreme ultraviolet lithography, larger wafer sizes and a variety of new materials. Shrinking feature sizes is still technically possible, but certainly not with the same promised economic benef... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 11 Jul, 2014 - Comments: 0

As feature sizes continue to shrink and new device architectures are introduced, the IC industry will require new breakthroughs. In fact, feature dimensions will soon have tolerances that are on the order of a few atoms. For the most advanced structures, conventional plasma etch and deposition processes are unable to meet these requirements. As a result, the industry will require tools th... » read more

Stacked Die Are Coming Soon. Really
By Ed Sperling - 10 Jul, 2014 - Comments: 3

Since the beginning of the decade there have been many predictions that stacked die were just over the hill, but the time it has taken to climb that hill has been longer than most people would have anticipated. In fact, TSMC has been fully capable of building stacked die since last year, with risk production expected to be completed by year, according to Gartner. But something very fundament... » read more

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