tag: Lam Research

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 10 Dec, 2021 - Comments: 0

Pervasive computing An outage in network equipment at the US-EAST-1 Region of Amazon Web Services this week reminded customers of the downside to having every appliance run via a data center. Users accessing apps tied to AWS on the East coast found services did not work, including Alexa, Ring, smart appliances, some Amazon warehouses and packaging delivery, web APIs such as Slack, and some str... » read more

Blog Review: Dec. 8
By Jesse Allen - 08 Dec, 2021 - Comments: 0

Arm's Shidhartha Das introduces a method to achieve fast yet accurate power modelling for both design and runtime power introspection within the same unified framework using machine learning and data science approaches. Synopsys' Mike Borza warns that the semiconductor industry is facing a flood of counterfeit chips and why being aware of different types of semiconductor scams and tackling t... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 03 Dec, 2021 - Comments: 0

Packaging and test Taiwan’s ASE--the world’s largest OSAT--has announced the proposed sale and disposal of equity interests in its subsidiaries, GAPT Holding and ASE (Kun Shan), to Wise Road Capital, a private equity firm based in China. The deal has a value of $1.46 billion. The announcement is related to four ASE assembly and test facilities in China, including Shanghai, Suzhou, Kunsh... » read more

Blog Review: Dec. 1
By Jesse Allen - 01 Dec, 2021 - Comments: 0

Synopsys' Mike Gianfagna points to three events that created a fundamental shift in product development that has enabled rapid introduction of a wide range of new products. Siemens' Sagi Reuven considers some key challenges facing the supply chain and the impact on electronics manufacturers, from rising shipping costs to shortages of raw materials and transportation labor. Cadence's Frank... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 19 Nov, 2021 - Comments: 0

Chipmakers China’s Tsinghua Unigroup is in trouble. The group is the parent company of China’s YMTC, a 3D NAND supplier, and other chip ventures. It is close to moving into bankruptcy proceedings. Now, a consortium led by Alibaba has emerged as the frontrunner to take over Tsinghua Unigroup, according to a report from Bloomberg. That deal would keep the company afloat, the report said. ... » read more

End In Sight For Chip Shortages?
By Mark LaPedus - 18 Nov, 2021 - Comments: 2

The current wave of semiconductor and IC packaging shortages is expected to extend well into 2022, but there are also signs that supply may finally catch up with demand. The same is true for manufacturing capacity, materials and equipment in both the semiconductor and packaging sectors. Nonetheless, after a period of shortages in all segments, the current school of thought is that chip suppl... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 29 Oct, 2021 - Comments: 0

Chipmakers After years in the works, GlobalFoundries is finally a public company. But on its first day of trading on Thursday (Oct. 28), shares of the foundry vendor slipped a bit. GF finished its first day of trading at $46.40. This compares to the $47 per share it priced in the initial public offering (IPO), according a report to Reuters. The chipmaker has a market capitalization of about $2... » read more

Scaling Bump Pitches In Advanced Packaging
By Mark LaPedus - 25 Oct, 2021 - Comments: 0

Interconnects for advanced packaging are at a crossroads as an assortment of new package types are pushing further into the mainstream, with some vendors opting to extend the traditional bump approaches while others roll out new ones to replace them. The goal in all cases is to ensure signal integrity between components in IC packages as the volume of data being processed increases. But as d... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 22 Oct, 2021 - Comments: 0

Chipmakers Apple has introduced its latest MacBook Pro notebooks built around the company’s new, in-house designed processors, dubbed the M1 Pro and M1 Max. The chips, to be incorporated in its 14- and 16-inch MacBook Pro systems, are the most powerful devices developed by Apple. The CPUs in the M1 Pro and M1 Max chips deliver up to 70% faster performance than the first M1 device. Based ... » read more

Gearing Up For High-NA EUV
By Mark LaPedus - 21 Oct, 2021 - Comments: 2

The semiconductor industry is moving full speed ahead to develop high-NA EUV, but bringing up this next generation lithography system and the associated infrastructure remains a monumental and expensive task. ASML has been developing its high-numerical aperture (high-NA) EUV lithography line for some time. Basically, high-NA EUV scanners are the follow-on to today’s EUV lithography systems... » read more

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