Tokyo Electron Ltd. (TEL) has signed a definitive agreement to sell its packaging equipment unit, TEL NEXX, to ASM Pacific Technology.
With the proposed deal, ASM Pacific enters some new markets. ASM Pacific sells wire bonders, pick-and-place systems, leadframes and other products.
Established in 2001, TEL NEXX sells electrochemical deposition (ECD) and physical vapor deposition (PVD) s...
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