Fostering Thermal Design Innovation Using Chip-Package-System Analysis Techniques


As devices continue to become smaller and more portable Moore’s Law continues to increase the number of transistors that fit within a chip albeit many predict an end to this in the near future. However new interconnect technologies that use Through-Silicon-Vias (TSVs) can place ICs next to each other using 2.5D Interposers or stack chips in 3D resulting in even greater system scaling. This co... » read more

Three Steps To Low Power Coverage Closure


By Awashesh Kumar and Madhur Bhargava Low-power design and verification is becoming more complex. Yet it is critical that all power elements are verified, and it is even more important to verify the complex interactions between these elements at a high abstraction level. However, power-aware coverage closure is difficult to attain and complex by nature. Existing low-power coverage methodo... » read more

Power Optimization Strategies Widen


An increasing amount of electronic content in new and existing markets is creating different and sometimes competing demands for power optimization. For the past decade, EDA has been driven by the mobile phone industry, where the emphasis is on better power analysis and optimization tools to reduce power consumption and extend battery life. While energy efficiency continues to improve, other... » read more

Implementation Of An Asynchronous Bundled-Data Router For A GALS NoC In The Context Of A VSoC


Designs of asynchronous networks-on-chip are of growing interest because a complete asynchronous implemen- tation can solve the synchronization problems of large networks. However, asynchronous circuits suffer from the lack of proper design flows because their functionality often relies on timing constraints, which are not extensively supported by common CAD synthesis tools. This paper proposes... » read more

Tech Talk: Improving Verification


Frank Schirrmeister, senior group director for product management and marketing at Cadence, discusses how to verify different use cases, focusing on software, low-power designs, connectivity, and a variety of end markets. https://youtu.be/gK-0vmIWxJs » read more

Bridging Machine Learning’s Divide


There is a growing divide between those researching [getkc id="305" comment="machine learning"] (ML) in the cloud and those trying to perform inferencing using limited resources and power budgets. Researchers are using the most cost-effective hardware available to them, which happens to be GPUs filled with floating point arithmetic units. But this is an untenable solution for embedded infere... » read more

PowerDown: Power Efficiency


Power Down Semiconductor wants to make the batteries in smartphones and IoT devices last 10 times longer by not wasting power they’ve already used. Every time an intelligent device has a thought, it pulls power from a battery and sends it through its maze of wires and millions of gates to create a O or a 1 at key points in the control and logic circuits. “Think about how much energy... » read more

The Implementation Of Embedded PVT Monitoring Subsystems In Today’s Cutting Edge Technologies


This new whitepaper from Moortec takes a comprehensive look at the Implementation of Embedded PVT Monitoring Subsystems in Today’s Cutting Edge Technologies and how this can benefit today’s advanced node semiconductor design engineers by improving the performance and reliability of SoC designs. With advances in CMOS technology, and the scaling of transistor channel lengths to nanometer (nm)... » read more

Tech Talk: Near-Threshold Power


Lauri Koskinen, CTO and founder of Minima Processor, and Ron Moore, vice president of marketing at ARM, talk about near-threshold computing, dynamic power and margining, and how these techniques can extend battery life and reduce energy consumption. https://youtu.be/BhiNFe4NYQU » read more

Lots Of Little Knobs For Power


Dynamic power is becoming a much bigger worry at new nodes as more finFETs are packed on a die and wires shrink to the point where resistance and capacitance become first-order effects. Chipmakers began seeing dynamic power density issues with the first generation of [getkc id="185" kc_name="finFETs"]. While the 3D transistor structures reduced leakage current by providing better gate contro... » read more

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