Low Density Of LPDDR4x DRAM — The Best Choice For Edge AI

By Winbond - 05 Jul, 2023 - Comments: 0

Edge AI computes the data as close as possible to the physical system. The advantage is that the processing of data does not require a connected network. The computation of data happens near the edge of a network, where the data is being developed, instead of in a centralized data-processing center. One of the biggest benefits of edge AI is the ability to secure real-time results for time-sensi... » read more

An Escalation of Rowhammer To Rows Beyond Immediate Neighbors

By Technical Paper Link - 15 Aug, 2022 - Comments: 0

Researchers at Graz University of Technology, Lamarr Security Research, Google, AWS, and Rivos presented this new technical paper titled "Half-Double: Hammering From the Next Row Over" at the USENIX Security Symposium in Boston in August 2022. Abstract: "Rowhammer is a vulnerability in modern DRAM where repeated accesses to one row (the aggressor) give off electrical disturbance whose cumu... » read more

Forward And Backward Compatibility In IC Designs

By Ann Mutschler - 30 Nov, 2020 - Comments: 0

Future-proofing of designs is becoming more difficult due to the accelerating pace of innovation in architectures, end markets, and technologies such as AI and machine learning. Traditional approaches for maintaining market share and analyzing what should be in the next rev of a product are falling by the wayside. They are being replaced by best-guesses about market trends and a need to bala... » read more

LPDDR4/4X DRAM Variants and Possible System Configurations

By Synopsys - 26 Feb, 2020 - Comments: 0

LPDDR is the de-facto standard for main-memory targeting mobile applications such as smartphones and tablets. Low-Power Double Data Rate Synchronous Dynamic Random Access Memories (LPDDR SDRAMs) or DRAMS offer high-performance while consuming significantly lower power than standard DDR memories, such as DDR5/4/3, which are ideal for systems requiring large memory capacity. For this reason, LPDD... » read more

Understanding the Interactions of Workloads and DRAM Types: A Comprehensive Experimental Study

By Technical Paper Link - 31 Dec, 2019 - Comments: 0

Abstract "It has become increasingly difficult to understand the complex interaction between modern applications and main memory, composed of DRAM chips. Manufacturers are now selling and proposing many different types of DRAM, with each DRAM type catering to different needs (e.g., high throughput, low power, high memory density). At the same time, the memory access patterns of prevalent and... » read more

How To Build An Automotive Chip

By Ann Mutschler - 07 Mar, 2019 - Comments: 0

The introduction of advanced electronics into automotive design is causing massive disruption in a supply chain that, until very recently, hummed along like a finely tuned sports car. The rapid push toward autonomous driving has changed everything. This year, Level 3 autonomy will begin hitting the streets, and behind the scenes, work is underway to design SoCs for Level 4. But how these chi... » read more

The Week In Review: Design

By Jesse Allen - 10 Mar, 2017 - Comments: 0

SoftBank plans to sell a 25% stake in ARM to Vision Fund, a $100 billion technology fund created last year by SoftBank and Saudi Arabia's Public Investment Fund. SoftBank and Saudi Arabia are investing $25 billion and $45 billion in the fund, respectively. Another potential major player is Mubadala Development Co., the government-owned Abu Dhabi investment firm which owns GlobalFoundries and, a... » read more

Using Multi-Channel Connections for Optimized LPDDR4 Power & Performance

By Marc Greenberg - 14 Apr, 2016 - Comments: 0

LPDDR4, the latest double data rate synchronous DRAM for mobile applications, includes a number of features that enable SoC design teams to reduce power consumption of discrete DRAM in mobile devices. Desktop devices like PCs and servers commonly utilize DDR devices mounted on dual inline memory modules (DIMM) hosted on 64-bit wide buses. This board-level solution allows field-upgradeable DRAM ... » read more

Optimizing LPDDR4 Performance And Power With Multi-Channel Architectures

By Synopsys - 10 Feb, 2016 - Comments: 0

PDDR4 offers huge bandwidth in a physically small PCB area and volume; up to 25.6 GByte/s of bandwidth at a 3,200 Mbps data rate from a single 15mmx15mm LPDDR4 package when two dies are packaged together. LPDDR4 builds on the success of LPDDR2 and LPDDR3 by adding new features and introducing a major architectural change. This white paper explains how LPDDR4 is different from all previous JEDEC... » read more

Inside The 5G Smartphone

By Mark LaPedus - 20 Aug, 2015 - Comments: 3

Amid a slowdown in the cell phone business, the market is heating up for perhaps the next big thing in wireless—5th generation mobile networks or 5G. In fact, major carriers, chipmakers and telecom equipment vendors are all rushing to get a piece of the action in 5G, which is the follow-on to the current wireless standard known as 4G or long-term evolution (LTE). Intel, Samsung and Qualcom... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?