DSA Defects Continue Downward Trend


As previously discussed, the majority of defects in early directed self-assembly (DSA) processes were due to particles and other contaminants, and could be attributed to the immaturity of the process and materials. As manufacturers consider whether to incorporate DSA into specific technology nodes, they need to assure themselves that production-worthy yields can be achieved. Recent research at ... » read more

Making It Differently


Anyone who hasn't bought into the IoT/E as a fundamental shift in electronics should check out what's happening in China. All appliances and electronics being developed for the home market are now being sold as smart-ready. This is a market that comprises roughly one-fifth (19.4% to be exact) of the world's population. In the future, whether or not you hook up a new washing machine or TV to ... » read more

Fab Capacity Shortages


Planning fab capacity is a little like parachuting out of an airplane. Your chances of getting hurt are 50-50 every time you jump, and past experience doesn't necessarily make it safer the next time. At the leading edge, there is debate about just how much capacity should be added at 16/14nm, or whether the lion's share of that investment should go to 10nm or even 7nm. At least part of the d... » read more

The Other IoT


What happens in the home, in the car, or in the tiny electronic devices people carry around with them or wear on their wrists or implant in their bodies is the focus of marketing by thousands of companies all over the globe. After all, the Internet of Things, in some shape or form, is widely expected to the "next big thing," or at least provide the foundation for many next big things. Far le... » read more

DSA Moves Ahead


It can be difficult to make DSA structures other than uniform arrays. One solution is to print a grating over a large area, then use a “cut” mask to eliminate the unwanted features. The challenge, though, is that aligning the cut mask to an array of tightly spaced features, such as the fins for a FinFET transistor layer, can require extremely demanding overlay specifications. While reducing... » read more

The Route To Faster Physical Verification And Better Designs


By Nancy Nguyen & Jean-Marie Brunet As we’ve moved to today’s leading-edge nodes, physical layout designers have faced more and more challenges to get their design to tape-out on schedule. Timing becomes increasingly difficult to converge, power reduction for both IR and leakage becomes a big issue, and most importantly, how do we meet all of the ever-growing and more complex signoff d... » read more

How To Reduce Implementation Headaches In FinFET Processes


In this era of compressed market windows and shrinking or changing technology, today’s engineers are always looking for ways to improve their overall product performance, power and area (PPA), while also decreasing their SoC design effort. The goal is to ease time-consuming and labor-intensive implementation tasks that will yield a reduction in design time, without sacrificing accuracy and op... » read more

Supply Chain Corruption


The more the chip supply chain relies on third-party sources, the greater the risk for a design containing potential malicious code or functions. Today, complex and sophisticated ICs are ubiquitous in virtually every industry. They are being relied upon, as never before, to control critical infrastructure subsystems such as power, finance, communications, and transportation. In a recent r... » read more

Fujitsu Reorgs For Manufacturing


Fujitsu officially announced its intention of reorganizing its semiconductor manufacturing businesses, including dividing the Aizu Wakamatsu factory and Mie factory as branches of the foundry companies. The rest of the organization, including the system memory department and Fujitsu Electronics will become a part of Fujitsu’s semiconductor group. The new Foundry Company will also be a part of... » read more

Manage Supply Chains To Enhance ERP And MRP Operations


The key for success in mass production is consistency and control of variables. One key variable that is difficult to control is the integrity of accounting for materials. Not all materials are used in the way that MRP intended and they are often used for products other than those intended. In addition to simple materials issues, demand patterns to the factory have changed significantly in r... » read more

← Older posts Newer posts →