tag: manufacturing

DSA Moves Ahead
By Katherine Derbyshire - 19 Dec, 2014 - Comments: 0

It can be difficult to make DSA structures other than uniform arrays. One solution is to print a grating over a large area, then use a “cut” mask to eliminate the unwanted features. The challenge, though, is that aligning the cut mask to an array of tightly spaced features, such as the fins for a FinFET transistor layer, can require extremely demanding overlay specifications. While reducing... » read more

The Route To Faster Physical Verification And Better Designs
By Jean-Marie Brunet - 18 Sep, 2014 - Comments: 0

By Nancy Nguyen & Jean-Marie Brunet As we’ve moved to today’s leading-edge nodes, physical layout designers have faced more and more challenges to get their design to tape-out on schedule. Timing becomes increasingly difficult to converge, power reduction for both IR and leakage becomes a big issue, and most importantly, how do we meet all of the ever-growing and more complex signoff d... » read more

How To Reduce Implementation Headaches In FinFET Processes
By Leah Schuth - 11 Sep, 2014 - Comments: 0

In this era of compressed market windows and shrinking or changing technology, today’s engineers are always looking for ways to improve their overall product performance, power and area (PPA), while also decreasing their SoC design effort. The goal is to ease time-consuming and labor-intensive implementation tasks that will yield a reduction in design time, without sacrificing accuracy and op... » read more

Supply Chain Corruption
By Ernest Worthman - 04 Sep, 2014 - Comments: 0

The more the chip supply chain relies on third-party sources, the greater the risk for a design containing potential malicious code or functions. Today, complex and sophisticated ICs are ubiquitous in virtually every industry. They are being relied upon, as never before, to control critical infrastructure subsystems such as power, finance, communications, and transportation. In a recent r... » read more

Fujitsu Reorgs For Manufacturing
By Kenji Tsuda - 02 Sep, 2014 - Comments: 0

Fujitsu officially announced its intention of reorganizing its semiconductor manufacturing businesses, including dividing the Aizu Wakamatsu factory and Mie factory as branches of the foundry companies. The rest of the organization, including the system memory department and Fujitsu Electronics will become a part of Fujitsu’s semiconductor group. The new Foundry Company will also be a part of... » read more

Manage Supply Chains To Enhance ERP And MRP Operations
By Mentor, a Siemens Business - 17 Jul, 2014 - Comments: 1

The key for success in mass production is consistency and control of variables. One key variable that is difficult to control is the integrity of accounting for materials. Not all materials are used in the way that MRP intended and they are often used for products other than those intended. In addition to simple materials issues, demand patterns to the factory have changed significantly in r... » read more

Secure SoC Manufacturing
By Rambus - 07 Jul, 2014 - Comments: 0

As mobile usage continues to permeate daily lives with increasingly sensitive data and high-value transactions, the importance of device security has become even more important. Information security begins at the point when Internet- connected devices are designed and manufactured. But today’s complex global supply chains are fraught with numerous challenges that can result in both security b... » read more

Tech Talk: Concurrent Test
By Ed Sperling - 18 Jun, 2014 - Comments: 2

Dave Armstrong, director of business development at Advantest, discusses the usefulness of concurrent test and describes how to maximize the value of this approach. [youtube vid=UFPxTlB2LWQ] » read more

Manufacturing Bits: June 10
By Ed Sperling - 10 Jun, 2014 - Comments: 2

Self-Assembling Nano Films Applying thin films with uniformity has always been an engineering challenge, but as feature sizes shrink the problem become even more pronounced. But a new approach developed by Lawrence Berkeley National Labs’ Materials Science Division could end up simplifying this process. The new approach used chloroform as an annealing solvent to create self-assembling arr... » read more

Shootout At 28nm
By Ed Sperling - 15 May, 2014 - Comments: 0

By Ed Sperling & Mark LaPedus Samsung, Soitec and STMicroelectronics are joining forces on 28nm FD-SOI, creating a showdown with TSMC and others over the best single-patterned processes and materials and raising questions about how quickly companies need to move to the finFET technology generation. The multi-source manufacturing collaboration agreement for fully depleted silicon-on-insulato... » read more

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