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Characterization Of HEMT Vias


The Zeta-Series optical profilers provide accurate measurement and automated analysis of high aspect ratio structures such as HEMT vias using non-destructive and high throughput metrology techniques.  Introduction Wide bandgap semiconductor materials are extremely attractive for use in power electronics, due to their performance capability at high temperature, power and frequency. Among wide... » read more

Measurement Of Deep Trenches To Study The RIE Lag Effect


The demand for accurate characterization of high aspect ratio geometries such as narrow gaps, deep trenches or deep holes arises in many technologies and industries. A variety of metrology techniques have been utilized to accommodate these needs. Among the candidates for this type of metrology, 3D optical profiling characterization is becoming more and more prevalent in process control. Due to ... » read more

Reliability Challenges Grow For 5/3nm


Ensuring that chips will be reliable at 5nm and 3nm is becoming more difficult due to the introduction of new materials, new transistor structures, and the projected use of these chips in safety- and mission-critical applications. Each of these elements adds its own set of challenges, but they are being compounded by the fact that many of these chips will end up in advanced packages or modul... » read more

Six Things You Need To Know About USB Instrument Control


With plug-and-play connectivity and the near ubiquity of USB ports on modern PCs and laptops, USB has become a popular choice for controlling stand-alone instrumentation. As more instrument manufacturers begin to include USB ports on their devices, it is important to understand several issues surrounding USB to ensure the longevity of your test system. To read more, click here. » read more

Clean Focus, Dose And CD Metrology For CD Uniformity Improvement


Authors: Honggoo Leea, Sangjun Hana, Minhyung Honga, Seungyong Kima, Jieun Leea, DongYoung Leea, Eungryong Oha, Ahlin Choia, Nakyoon Kimb, John C. Robinsonc, Markus Mengelc, Pablo Rovirac, Sungchul Yooc, Raphael Getinc, Dongsub Choib, Sanghuck Jeonb aSK Hynix, 2091, Gyeongchung-daero, Bubal-eub, Icheon-si, Gyeonggi-do, 467-701, Korea bKLA-Tencor Korea, Starplaza bldg., 53 Metapolis-ro, Hwasung... » read more

Best Practices For Saving Measurement Data


You collect data to make decisions. However, an inefficient file format may cause problems when analyzing your data. The key to choosing a file format for your application involves thinking about the current system requirements and how the file can adapt for future application needs. To help you organize your file format for your application, use the guide and checklist of questions: • Ho... » read more

Finding Defects In Chips With Machine Learning


Chipmakers are using more and different traditional tool types than ever to find killer defects in advanced chips, but they are also turning to complementary solutions like advanced forms of machine learning to help solve the problem. A subset of artificial intelligence (AI), machine learning has been used in computing and other fields for decades. In fact, early forms of machine learning ha... » read more