tag: mechanical stress

Stress-Related Local Layout Effects In FinFET Technology And Device Design Sensitivity
By PDF Solutions - 10 Jun, 2025 - Comments: 0

Abstract: "Transistor characteristics in advanced technology nodes are strongly impacted by devices design and process integration choices. Variation in the layout and pattern configuration in close proximity to the device often causes undesirable sensitivities known as Local Layout Effects (LLEs). One of the sensitivities is related to carrier mobility dependence on mechanical stress, modul... » read more

Addressing Stress In Heterogeneous 3D-IC Designs
By Shetha Nolke - 29 May, 2025 - Comments: 0

The benefits of 3D IC architectures are well-documented – smaller footprints, lower power, and increased performance. However, the move to heterogeneous 3D designs also introduces a host of new challenges that must be carefully navigated. As chip designers integrate multiple dies and technologies into a single 3D package, the interactions between the chip and package become increasingly co... » read more

The Other Side Of The Wafer: Transistor Channel Stress In Backside Power Delivery Networks
By Sam Sarkar - 17 Apr, 2025 - Comments: 0

As transistor scaling has moved to the angstrom era (18A, 14A, etc.), the issues of interconnect resistance (IR), IR drop, and power loss are becoming more severe. Traditionally, signal lines and power lines are fabricated on the same side of the wafer as the active device. But fabricating everything on one side of the wafer can create a shortage of space and resources at the interconnect la... » read more

Mechanical Stress In Semiconductor Development
By Ivan Chakarov - 20 Feb, 2025 - Comments: 0

With the semiconductor industry moving toward 3D DRAM, 3D logic architectures, and 1000+ layer 3D NAND stacks,1 mechanical failures may become more common. Due to the complexity of these structures, mechanical stress from materials processing has the potential to significantly impact yield. 3D processing techniques (etching, deposition, and related chemistries), as well as material property de... » read more

Strain, Stress In Advanced Packages Drives New Design Approaches
By Ann Mutschler - 19 Dec, 2024 - Comments: 2

Thermal and mechanical stresses are creating significant challenges in heterogeneous chiplet assemblies, increasing the time and cost required to work through all the possible physical effects, dependencies, and interactions, and driving demand for new tools. Unlike in the past, when various components were crammed into a planar SoC on a relatively thick substrate, the new substrates are bei... » read more

Reliability On The Road: Multiphysics Design For Automotive 3D-ICs
By John Ferguson - 07 Nov, 2024 - Comments: 0

Anyone who has purchased a car over the past decade knows that there has been a huge increase in the amount of compute processing involved in today’s modern automotive industry. Advanced chips for diagnostics and entertainment as well as logic associated with advanced sensor technology and automated assist features have quickly become key requirements that drivers rely on every day to ensure ... » read more

Where Power Savings Really Count
By Ed Sperling - 31 Jul, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss why and where improvements in architectures and data movement will have the biggest impact, with Hans Yeager, senior principal engineer, architecture, at Tenstorrent; Joe Davis, senior director for Calibre interfaces and EM/IR product management at Siemens EDA; Mo Faisal, CEO of Movellus; Trey Roessig, CTO and senior vice presi... » read more

The 3D-IC Multiphysics Challenge Dictates A Shift-Left Strategy
By John Ferguson - 25 Apr, 2024 - Comments: 0

As the industry marches forward in a 3D-IC centric design approach (figure 1), we are facing a new problem. Sometimes referred to as “electro-thermal” or “electro-thermo-mechanical,” it really is the confluence of multiple forms of physics exerting impacts on both the physical manufacture and structure of these multi-die designs and their electrical behavior. Fig. 1: Illustration... » read more

Predicting Warpage in Different Types of IC Stacks At Early Stage Of Package Design
By Technical Paper Link - 15 Mar, 2024 - Comments: 0

A new technical paper titled "Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects" was published by researchers at Siemens EDA, D2S, and Univ. Grenoble Alpes, CEA, Leti. Abstract: "A physics-based multi-scale simulation methodology that analyses die stress variations generated by package fabrication is employed for warpage study. The ... » read more

Managing Thermal-Induced Stress In Chips
By Karen Heyman - 16 Feb, 2023 - Comments: 0

At advanced nodes and in the most advanced packages, physics is no one's friend. Escalating density, smaller features, and thinner dies make it more difficult to dissipate heat, and they increase mechanical stress. On the flip side, thinner dielectrics and tighter spaces make it more difficult to insulate and protect against that heat, and in conjunction with those smaller features and higher d... » read more

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