Building Functional Safety And Security Into Medical IoT Devices: IEC 62304 Conformance

By Mentor, a Siemens Business - 05 Apr, 2017 - Comments: 0

As the IoT marches on – security and safety issues continue to be a top priority for embedded systems developers. Building security into your medical IoT device not only helps to reduce the chance of a data breach or cyber attack, but also introduces new ways to optimize software, reduces time to market, and increases the potential for product innovation in a very competitive global market. ... » read more

Quality Issues Widen

By Ed Sperling - 06 Mar, 2017 - Comments: 0

As the amount of semiconductor content in cars, medical and industrial applications increases, so does the concern about how long these devices will function properly—and what exactly that means. Quality is frequently a fuzzy concept. In mobile phones, problems have ranged from bad antenna placement, which resulted in batteries draining too quickly, to features that take too long to load. ... » read more

What Next For OSATs

By Mark LaPedus - 06 Mar, 2017 - Comments: 0

Semiconductor Engineering sat down to discuss IC-packaging and business trends with Tien Wu, chief operating officer at Taiwan’s Advanced Semiconductor Engineering ([getentity id="22930" comment="ASE"]), the world’s largest outsourced semiconductor assembly and test (OSAT) vendor. What follows are excerpts of that conversation. SE: What’s the outlook for the IC industry in 2017? Wu:... » read more

The Path To (Virtually) Zero Defective Parts Per Million

By Synopsys - 22 Feb, 2017 - Comments: 0

Despite thorough wafer and package testing, a small number of defective ICs can make their way into systems. These test "escapes" often return as field failures, increasing costs and eroding profit margins. They can also present a hazard if deployed in safety-critical systems, which is why companies purchasing semiconductors for automotive, medical, or aerospace applications often demand a zero... » read more

Power/Performance Bits: Jan. 10

By Jesse Allen - 10 Jan, 2017 - Comments: 0

Antiferromagnetic magnetoelectric RAM Researchers at Helmholtz-Zentrum Dresden-Rossendorf (HZDR), Swiss Nanoscience Institute, and the University of Basel developed a concept for a new, low power memory chip. In particular, the group focused on finding an alternative to MRAM using magnetoelectric antiferromagnets, which are activated by an electrical voltage rather than by a current. "... » read more

The Role Of Energy-Efficient Circuits In Wearable Healthcare Applications

By Christine Young - 11 Aug, 2016 - Comments: 0

As beneficial as they are, health monitors for conditions like high blood pressure, arrhythmia, and epilepsy can be uncomfortable and inconvenient due to all of their protruding wires. This opens up an opportunity for designers of wearable healthcare applications. “Wearable electronics are needed for proactive healthcare,” said Dr. Jerald Yoo, an associate professor in the Department of ... » read more

Medical IoT Showing Signs Of Life

By Jeff Dorsch - 04 Aug, 2016 - Comments: 0

Mention the [getkc id="76" comment="Internet of Things"] and many people think of fitness trackers on their wrists, or an Internet-connected thermostat at home. IoT technology, however, is also extending into the world of clinics, doctors’ offices, and hospitals. Research and Markets is calling it the Internet of Healthcare Technology, bringing together IoT applications, services, and ... » read more

Automating Inter-Layer In-Design Checks In Rigid-Flex PCBs

By Cadence - 27 Jul, 2016 - Comments: 0

Flexible PCBs (flex/rigid-flex) make it possible to create a variety of products that require small form factors and light weight, such as wearable, mobile, military, and medical devices. As flexible PCB fabrication technology has matured in response to demands for smaller, lighter products, new design challenges have emerged. This paper discusses some of the key challenges to address and also ... » read more

Designing Power-Efficient, Implantable Medical Devices

By Christine Young - 14 Jul, 2016 - Comments: 0

Medical devices used for treatment traditionally tend to be big, bulky, and full of wires, making them uncomfortable or inconvenient for the patient to use. For Dr. Rikky Muller and Cortera Neurotechnologies, power-efficient, implantable medical devices provide a viable alternative. Muller is an assistant professor of electrical engineering and computer sciences at UC Berkeley. She is also a... » read more

Sharing Information About Corner Cases

By Ed Sperling - 07 Jul, 2016 - Comments: 0

The definition of what is good enough when it comes to new technology is still evolving. In safety-critical applications, as well as a number of other areas such as drones or domestic robots, people will need to watch over all machines very closely rather than the other way around. While these machines may serve a useful purpose, they also need to be monitored to ensure they don't go too far as... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: medical