tag: Mentor Graphics

3D-IC Testing With The Mentor Graphics Tessent Platform
By Various Writers - 20 Jun, 2013 - Comments: 0

Three-dimensional stacked integrated circuits (3D-ICs) are composed of multiple stacked die, and are viewed as critical in helping the semiconductor industry keep pace with Moore's Law. Current integration and interconnect methods include wirebond and flip-chip and have been in production for some time. 3D chips connected via interposers are in production at Xilinx, Samsung, IBM, and Sematec... » read more

Manufacturing Ecosystem Challenges
By Ed Sperling - 19 Jun, 2013 - Comments: 0

What are the challenges facing semiconductor manufacturers and designers at the leading edge of Moore's Law? Semiconductor Manufacturing & Design asked Kevin Kranen of Synopsys, Seow Yin Lim of Cadence, Michael Buehler-Garcia of Mentor Graphics and Tom Quan of TSMC. [youtube vid=d6-zMJSxnpg] » read more

Drowning In Data
By Ed Sperling - 13 Jun, 2013 - Comments: 0

By Ed Sperling The old adage, “Be careful what you wish for,” has hit the SoC design market like a 100-year storm. After years of demanding more data to understand what’s going on in a design, engineering teams now have so much data that they’re drowning in it. This is most obvious at advanced process nodes, of course. But it’s also true these days at more mainstream nodes such as... » read more

The Shape Of Things To Come
By Ed Sperling - 13 Jun, 2013 - Comments: 0

By Ed Sperling The standard method of designing chips—by shrinking features and turning up the clock frequency—is running out of steam for many companies. It’s too difficult, too expensive, and without a commercially viable new lithography source it may become even more unrealistic for most applications. That certainly doesn’t mean Moore’s Law is ending, but it could become more o... » read more

Power Grid Analysis
By Marko Chew - 13 Jun, 2013 - Comments: 1

By Marko Chew Introduction Power grids (PGs) have consumed an increasingly larger percentage of routing resources in recent process node generations, due to lower maximum current limits imposed by the foundry. It is not uncommon to see upwards of 30% of the routing resources consumed by the PG, with correspondingly negative implications for a design’s routability. Of course, the design’... » read more

The Week In Review: June 7
By Ed Sperling - 07 Jun, 2013 - Comments: 0

By Ed Sperling For all the hesitation about moving the Design Automation Conference to Austin, it turns out that Austin has a lot of hardware engineers. In fact they flooded into the conference, turning it into one of the most successful in recent years and setting new records in multiple areas. Even Texas Gov. Rick Perry showed up to see what all the fuss was about. Mentor Graphics added c... » read more

Experts At The Table: The Growing Signoff Headache
By Ed Sperling - 07 Jun, 2013 - Comments: 0

By Ed Sperling Low-Power/High-Performance Engineering sat down to discuss signoff issues with Rob Aitken, an ARM fellow; Sumbal Rafiq, director of engineering at Applied Micro; Ruben Molina, product marketing director for timing signoff at Cadence; Carey Robertson, director of product marketing for Calibre extraction at Mentor Graphics; and Robert Hoogenstryd, director of marketing for design ... » read more

Experts At The Table: Power Budgeting
By Ed Sperling - 03 Jun, 2013 - Comments: 0

By Ed Sperling Low-Power Engineering sat down with Barry Pangrle, solutions architect for low-power design and verification at Mentor Graphics; Cary Chin, director of technical marketing for low-power solutions at Synopsys; Vic Kulkarni, general manager of the RTL business unit at Apache Design Solutions; Matt Klein, principal engineer for power and broadcast applications at Xilinx; and Paul ... » read more

The Week In Review: May 31
By Ed Sperling - 31 May, 2013 - Comments: 0

By Ed Sperling Mentor Graphics and GlobalFoundries teamed up to deliver 20nm design kits that include Mentor’s place and route tool, including verification and conflict resolution engines for double-patterning violations. The 20nm process is used for GlobalFoundries’ 14nm finFETs. Mentor also received 16nm finFET certification from TSMC for the same tools plus its physical verification pl... » read more

Experts At The Table: The Growing Signoff Headache
By Ed Sperling - 31 May, 2013 - Comments: 0

By Ed Sperling Low-Power/High-Performance Engineering sat down to discuss signoff issues with Rob Aitken, an ARM fellow; Sumbal Rafiq, director of engineering at Applied Micro; Ruben Molina, product marketing director for timing signoff at Cadence; Carey Robertson, director of product marketing for Calibre extraction at Mentor Graphics; and Robert Hoogenstryd, director of marketing for design... » read more

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