tag: Mentor

Blog Review: Oct. 27
By Jesse Allen - 27 Oct, 2021 - Comments: 0

Siemens EDA's Ray Salemi continues looking into using Python for verification by looking at how pyuvm simplifies and refactors the UVM TLM system to take advantage of the fact that Python has multiple inheritance and no typing. Cadence's Paul McLellan listens in as Larry Disenhof explains the impact that export regulations have on EDA tools and IP products and changes in a rapidly shifting l... » read more

Week In Review: Auto, Security, Pervasive Computing
By Ed Sperling - 22 Oct, 2021 - Comments: 0

An investigation by the Automobile Association of America found that lane-keeping assist and automatic emergency braking, both high-profile ADAS features, are prone to failure in rain. According to the report, 69% of tests conducted with simulated rainfall resulted in test vehicles crossing lane markers, and 33% of simulations resulted in collisions at 35 mph. Surprisingly, risk of accidents di... » read more

Week In Review: Design, Low Power
By Jesse Allen - 22 Oct, 2021 - Comments: 0

Tools Cadence's digital and custom/analog flows were certified for TSMC's N3 and N4 process technologies. Updates for the digital flow includes efficient processing of large libraries, additional accuracy during library cell characterization and static timing analysis, and support for accurate leakage calculation required in N3 and static power calculation for new N3 cells. Synopsys' digita... » read more

Blog Review: Oct. 20
By Jesse Allen - 20 Oct, 2021 - Comments: 0

Siemens EDA's Sumit Vishwakarma promotes ironing out preliminary bugs by using a real number model to describe an analog block as a discrete floating-point model and enable it to simulate in a digital solver at near-digital simulation speeds. Synopsys' Taylor Armerding explains how including security in the software development process from the beginning planning stages onward will help IoT ... » read more

Total Critical Area For Optimizing Test Patterns
By Ed Sperling - 19 Oct, 2021 - Comments: 0

Increasing complexity at advanced nodes makes it much harder to locate defects and latent defects because there is more surface area to cover and much less space between the various components in a leading-edge chip design. Ron Press, technology enablement director at Siemens Digital Industries Software, talks about why it’s so important to predict where defects are most likely to occur in th... » read more

Get Ready For The Next Generation Of Wearable Tech
By Brian Bailey - 18 Oct, 2021 - Comments: 0

Wearables have attracted a lot of attention recently, due to both their successes as well as failures. They bring together requirements for packaging, new substrates, power scavenging, low-power, novel connectivity, flexibility, durability, as well as fashion. While some of the challenges remain formidable, the long-term potential is driving the industry to look at what is possible. They are... » read more

Week In Review: Design, Low Power
By Jesse Allen - 15 Oct, 2021 - Comments: 0

Nvidia acquired Oski Technology. Oski provides formal verification methodologies and consulting services, and Nvidia said that the acquisition will allow it to increase its investment in formal verification strategies. Oski's Gurugram, India, design center will become Nvidia's fourth engineering office in the country. Based in San Jose, Calif., it was founded in 2005. Terms of the deal were not... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 15 Oct, 2021 - Comments: 0

Automotive Synopsys and 3D virtual-environment company Dassault Systèmes are collaborating on an automotive lighting system development platform. Synopsys’ optical design tools — LucidShape, LightTools, and CODE V — will be integrated with Dassault Systèmes' 3DEXPERIENCE Platform, which is used by automotive teams from different disciplines to work together on designs and simulations. ... » read more

Architecting Interposers
By Brian Bailey - 14 Oct, 2021 - Comments: 0

An interposer performs a similar function as a printed circuit board (PCB), but when the interposer is moved inside a package the impact is significant. Neither legacy PCB nor IC design tools can fully perform the necessary design and analysis tasks. But perhaps even more important, adding an interposer to a design may require organizational changes. Today, leading-edge companies have shown ... » read more

Will Co-Packaged Optics Replace Pluggables?
By Bryon Moyer - 14 Oct, 2021 - Comments: 0

As optical connections work their way deeper into the data center, a debate is underway. Is it better to use pluggable optical modules or to embed lasers deep into advanced packages? There are issues of convenience, power, and reliability driving the discussion, and an eventual winner isn’t clear yet. “The industry is definitely embracing co-packaged optics,” said James Pond, principal... » read more

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