tag: Mentor

Week In Review: Design, Low Power
By Jesse Allen - 17 Jun, 2022 - Comments: 0

Tools, design, chips Altair, a provider of software and cloud services for CAE, HPC, simulation, and data analysis, acquired Concept Engineering, a provider of automatic schematic generation tools, electronic circuit and wire harness visualization platforms that provide on-the-fly visual rendering, and electronic design debug solutions. “Concept Engineering’s advanced, reactive visualizati... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 17 Jun, 2022 - Comments: 0

Automotive, mobility U.S. National Highway Traffic Safety Administration (NHTSA) release its first crash reports from ADAS (advanced driver assistance systems, i.e., SAE Level 2) and ADS (automated driving systems, i.e., SAE Levels 3-5).  The systems had to be in use at least 30 seconds before the crash in order for it to be reportable. The car may have had the system turned off at the time ... » read more

Blog Review: June 15
By Jesse Allen - 15 Jun, 2022 - Comments: 0

Ansys' Vidyu Challa considers common primary, or single-use, battery chemistries and how they affect that many important cell properties, such as energy density, flammability and safety, available cell constructions, temperature range, and shelf life. Synopsys' Rimpy Chugh and Rohit Kumar Ohlayan discuss some of the challenges arising from static linting of code, shifting linting left in the... » read more

Audio, Visual Advances Intensify IC Design Tradeoffs
By Ann Mutschler - 13 Jun, 2022 - Comments: 0

A spike in the number of audio and visual sensors is greatly increasing design complexity in chips and systems, forcing engineers to make tradeoffs that can affect performance, power, and cost. Collectively, these sensors generate so much data that designers must consider where to process different data, how to prioritize it, and how to optimize it for specific applications. The tradeoffs in... » read more

Can Analog Make A Comeback?
By Brian Bailey - 09 Jun, 2022 - Comments: 3

We live in an analog world dominated by digital processing, but that could change. Domain specificity, and the desire for greater levels of optimization, may provide analog compute with some significant advantages — and the possibility of a comeback. For the last four decades, the advantages of digital scaling and flexibility have pushed the dividing line between analog and digital closer ... » read more

Emulation-Centric Power Analysis Of SoC Designs
By Lauro Rizzatti - 09 Jun, 2022 - Comments: 0

Verification expert Lauro Rizzatti recently interviewed Jean-Marie Brunet, senior marketing director, Scalable Verification Solutions Division (SVSD), Siemens EDA, about the importance of accurate power estimation and optimization for system-on-chip (SoC) designs. What is the problem facing the semiconductor industry today regarding pre-silicon power estimation? The problem is the discrep... » read more

DRAM Thermal Issues Reach Crisis Point
By Karen Heyman - 09 Jun, 2022 - Comments: 5

Within the DRAM world, thermal issues are at a crisis point. At 14nm and below, and in the most advanced packaging schemes, an entirely new metric may be needed to address the multiplier effect of how thermal density increasingly turns minor issues into major problems. A few overheated transistors may not greatly affect reliability, but the heat generated from a few billion transistors does.... » read more

IP Industry Transformation
By Brian Bailey - 09 Jun, 2022 - Comments: 0

The design IP industry is developing an assortment of new options and licensing schemes that could affect everything from how semiconductor companies collaborate to how ICs are designed, packaged, and brought to market. The IP market already has witnessed a sweeping shift from a "design once, use everywhere" approach, to an "architect once, customize everywhere" model, in which IP is highly ... » read more

Keeping IC Packages Cool
By Laura Peters and Karen Heyman - 07 Jun, 2022 - Comments: 0

Placing multiple chips into a package side-by-side can alleviate thermal issues, but as companies dive further into die stacking and denser packaging to boost performance and reduce power, they are wrestling with a whole new set of heat-related issues. The shift to advanced packaging enables chipmakers to meet demands for increasing bandwidth, clock speeds, and power density for high perform... » read more

Removing Barriers For End-To-End Analytics
By Anne Meixner - 07 Jun, 2022 - Comments: 0

Parties are coming together, generating guidelines for sharing data from IC design and manufacturing through end of life, setting the stage for true end-to-end analytics. While the promise of big data analytics is well understood, data sharing through the semiconductor supply chain has been stymied by an inability to link together data sources throughout the lifecycle of a chip, package, or ... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy