The Evolving Digital Journey Of The Electronics Value Chain


Digitally transforming how the electronics value chain is traversed will unlock the full innovative potential of system design companies all over the world. By augmenting desktop authoring tools with integrated, native cloud applications that seamlessly connect companies with the electronics value chain, design teams will be empowered to confidently deliver on aggressive requirements, schedules... » read more

High-Level Synthesis: It’s Still Hardware Design


Hardware design using HLS is no different than the typical ASIC/FPGA design flow with the exception that C++/SystemC is being used along with HLS to create the RTL instead of hand coding it. The advantage of using HLS is that it speeds up RTL creation time and reduces verification time by producing bug free RTL quickly from a fully verified C++/SystemC source. The misconception that still exist... » read more

Blog Review: May 25


Coventor's Michael Hargrove points to the need for a new generation of deep-submicron CMOS circuits that can operate at deep-cryogenic temperatures to achieve a quantum integrated circuit where the array of qubits is integrated on the same chip as the CMOS electronics required to read the state of the qubits. Ansys' Marc Swinnen warns about dynamic voltage drop as ultra-low supply voltages, ... » read more

Embedded Software: Sometimes Easier, Often More Complex


Embedded software, once a challenge to write, update, and optimize, is following the route of other types of software. It is abstracted, simpler to use, and much faster to write. But in some cases, it's also much harder to get right. From a conceptual level, the general definition of embedded software has not changed much. It's still low-level drivers and RTOSes that run close to the hardwar... » read more

Standardizing Chiplet Interconnects


The chip industry is making progress on standardizing the infrastructure for chiplets, setting the stage for faster and more predictable integration of different functions and features from different vendors. The ability to choose from a menu of small, highly specialized chips, and to mix and match them for specific applications and use cases, has been on the horizon for more than a decade. ... » read more

Week In Review: Manufacturing, Test


GlobalFoundries launched GF Labs, an “open framework of internal and external research and development initiatives that deliver a differentiated pipeline of market-driven process technology solutions for future data-centric, connected, intelligent and secure applications.” Greg Bartlett, GF's senior vice president of technology, engineering at quality, said the goal is to develop and exp... » read more

Week In Review: Design, Low Power


Cadence's digital full flow was certified for the GlobalFoundries 12LP/12LP+ process platforms. The certified tools include the Innovus Implementation System, Genus Synthesis Solution, Tempus Timing Signoff Solution, Voltus IC Power Integrity Solution, Quantus Extraction Solution, Litho Physical Analyzer (LPA), and Pegasus Verification System. Siemens Digital Industries Software's Calibre nm... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive, mobility The number new energy vehicles (NEVs) sold went up 80% from year over year, says TrendForce in its review of market for Q1 2022. NEVs are battery electric vehicles (BEVs), plug-in hybrid electric vehicles (PHEVs), and fuel cell vehicles. Over 2.004 million units sold in the first quarter of 2022 (1Q22), with BEVs making the strongest showing at 1.508 million units, a 271% ... » read more

Blog Review: May 18


Coventor's Gerold Schropfer considers taking an approach from the early days of computing and using MEMS technology to create computers based on micro-scale electro-mechanical logic and memory for emerging low-energy computing applications such as autonomous sensor nodes and edge computing. Synopsys' Morten Christiansen explains how USB4 differs from USB 3.2, allowing simultaneous host-to-ho... » read more

New End Markets, More Demand For Complex Chips


Experts at the Table: Semiconductor Engineering sat down to discuss economic conditions and how that affects chip design with Anirudh Devgan, president and CEO of Cadence; Joseph Sawicki, executive vice president of Siemens EDA; Niels Faché, vice president and general manager at Keysight; Simon Segars, advisor at Arm; and Aki Fujimura, chairman and CEO of D2S. This discussion was held in front... » read more

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