tag: Mentor

SRAM Scaling Issues, And What Comes Next
By Karen Heyman - 15 Feb, 2024 - Comments: 0

The inability of SRAM to scale has challenged power and performance goals forcing the design ecosystem to come up with strategies that range from hardware innovations to re-thinking design layouts. At the same time, despite the age of its initial design and its current scaling limitations, SRAM has become the workhorse memory for AI. SRAM, and its slightly younger cousin DRAM, have always co... » read more

IC Package Physical Design Best Practices
By Siemens EDA - 15 Feb, 2024 - Comments: 0

Historically IC package design has been a relatively simple task which allowed the die bumps to be fanned out on a package substrate to a floorplan geometry suitable for connecting to a printed circuit board (PCB). But today the industry is moving to disaggregation of traditional monolithic SoC functions into chiplets often interfaced with local high-speed memory to avoid silicon reticle limits... » read more

Blog Review: Feb. 14
By Liz Allan - 14 Feb, 2024 - Comments: 0

Siemens’ Dilan Heredia and Karen Chow explain why fast, accurate parasitic extraction (PEX) is essential to design success, especially for the 3 nm node and GAAFETs. Synopsys’ Srinivas Velivala debunks the myth that layout-versus-schematic (LVS) checking is a static step in the chip development process, and details its evolving role in modern SoCs. Cadence’s Mark Seymour digs into a... » read more

Memory’s Future Hinges On Reliability
By Karen Heyman - 14 Feb, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about the impact of power and heat on off-chip memory, and what can be done to optimize performance, with Frank Ferro, group director, product management at Cadence; Steven Woo, fellow and distinguished inventor at Rambus; Jongsin Yun, memory technologist at Siemens EDA; Randy White, memory solutions program manager at Keysight; a... » read more

Chip Industry Week In Review
By The SE Staff - 09 Feb, 2024 - Comments: 0

By Jesse Allen, Linda Christensen, and Liz Allan.  The Biden administration plans to invest more than $5B  for semiconductor R&D and workforce support, including in the National Semiconductor Technology Center (NSTC), as part of the rollout of the CHIPS Act. Today's announcement included at least hundreds of millions for the NSTC workforce efforts, including creating a Workforce Cente... » read more

Blog Review: Feb. 7
By Jesse Allen - 07 Feb, 2024 - Comments: 0

Synopsys' Ian Land, Kenneth Larsen, and Rob Aitken find that a new approach will be required to ensure that higher volume 3D heterogeneous integration (3DHI) designs can function reliably and successfully in aerospace, defense, and government systems. Siemens' John Golding provides a primer on the fundamental concepts related to signal integrity, including key topics such as transmission lin... » read more

Software-Defined Vehicles Ready To Roll
By Ann Mutschler - 05 Feb, 2024 - Comments: 0

Software-defined vehicles are driving a swell of activity across the automotive ecosystem, including new methodologies and technology approaches that could significantly reduce costs and shorten time to market for advanced features. The SDV approach encompasses more than a single concept. It helps to think of it more as a modeling approach that connects EVs, driver assistance technology, and... » read more

Chip Industry Week In Review
By The SE Staff - 02 Feb, 2024 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan. Cadence introduced an AI-based thermal stress and analysis platform aimed at 2.5D and 3D-ICs, and cooling for PCBs and electronic assemblies. The company also debuted a HW/SW accelerated digital twin solution for multi-physics system design and analysis, combining GPU-resident computational fluid dynamics (CFD) solvers with dedicated GPU hardwar... » read more

Dealing With Noise In Image Sensors
By Karen Heyman - 01 Feb, 2024 - Comments: 0

The expanding use and importance of image sensors in safety-critical applications such as automotive and medical devices has transformed noise from an annoyance into a life-threatening problem that requires a real-time solution. In consumer cameras, noise typically results in grainy images, often associated with poor lighting, the speed at which an image is captured, or a faulty sensor. Typi... » read more

Role For ICs Expands In Humanoid Robots
By John Koon - 01 Feb, 2024 - Comments: 0

Semiconductors play a crucial role in the development and functionality of humanoid robots. Humanoid robots are advanced machines designed to resemble and perform tasks similar to humans. The integration of semiconductors in humanoid robots contributes to their sensory perception, processing capabilities, and overall functionality. Robots are used in everything from security and defense, to ... » read more

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