tag: Mentor

Developing An Unbreakable Cybersecurity System
By John Koon - 01 Jun, 2023 - Comments: 0

Cyberattacks are increasing in frequency and sophistication, and the impact of those attacks is increasing almost exponentially as the amount and value of data continues to grow. Cybersecurity Ventures projected the annual cost of cybercrime will grow from $8 trillion in 2023 to $210.5 trillion by 2025, with no end in sight. On the target list are a slew of industrial and commercial segments... » read more

Security Becomes Much Bigger Issue For AI/ML Chips, Tools
By Lou Covey - 01 Jun, 2023 - Comments: 0

Security is becoming a bigger issue in AI and machine learning chips, in part because the chip industry is racing just to get new devices working, and in part because it's difficult to secure a new technology that is expected to adapt over time. And unlike in the past, when tools and methodologies were relatively fixed, nearly everything is in motion. Algorithms are being changed, EDA tools ... » read more

How Many Sensors For Autonomous Driving?
By John Koon - 01 Jun, 2023 - Comments: 0

With the cost of sensors ranging from $15 to $1,000, carmakers are beginning to question how many sensors are needed for vehicles to be fully autonomous at least part of the time. Those sensors are used to collect data about the surrounding environment, and they include image, lidar, radar, ultrasonic, and thermal sensors. One type of sensor is not sufficient, because each has its limitation... » read more

Blog Review: May 31
By Jesse Allen - 31 May, 2023 - Comments: 0

Cadence's Moshik Rubin looks at how the Portable Test and Stimulus Standard (PSS) is finding new use cases in ATE production test by enabling creation of a rich set of functional test scenarios in a reusable way. Synopsys' LJ Chen and Dana Neustadter check out the latest version of the Universal Flash Storage (UFS) standard, which doubles the data transfer rate of the preceding UFS 3.1 solut... » read more

Software-Defined Hardware Architectures
By Brian Bailey - 31 May, 2023 - Comments: 0

Hardware/software co-design has been a goal for several decades, but success has been limited. More recently, progress has been made in optimizing a processor as well as the addition of accelerators for a given software workload. While those two techniques can produce incredible gains, it is not enough. With increasing demands being placed on all types of processing, single-processor solutio... » read more

Chiplet Planning Kicks Into High Gear
By Ann Mutschler - 25 May, 2023 - Comments: 0

Chiplets are beginning to impact chip design, even though they are not yet mainstream and no commercial marketplace exists for this kind of hardened IP. There are ongoing discussions about silicon lifecycle management, the best way to characterize and connect these devices, and how to deal with such issues as uneven aging and thermal mismatch. In addition, a big effort is underway to improve... » read more

Chip Design CEO Outlook
By Ed Sperling - 25 May, 2023 - Comments: 0

Semiconductor Engineering sat down with Joseph Sawicki, executive vice president for IC EDA at Siemens Digital Industries Software; John Kibarian, president and CEO of PDF Solutions; John Lee, general manager and vice president of Ansys' Semiconductor Business Unit; Niels Faché, vice president and general manager of PathWave Software Solutions at Keysight; Dean Drako, president and CEO of IC M... » read more

IP Becoming More Complex, More Costly
By Brian Bailey - 25 May, 2023 - Comments: 0

Success in the semiconductor intellectual property (IP) market requires more than a good bit of RTL. New advances mandate a complete design, implementation, and verification team, which limits the number of companies competing in this market. What constitutes an IP block has changed significantly since the concept was first introduced in the 1990s. What was initially just a piece of RTL (reg... » read more

Stitching Together A Multi-Layer PCB PDN
By Patrick Carrier - 25 May, 2023 - Comments: 0

A printed circuit board (PCB) is much like a complicated city, with a myriad of intertwined pathways for data signals and power. To meet the electric current needs of modern, high-powered integrated circuits (ICs), the power distribution network (PDN) usually consists of wide power planes on multiple layers to provide a low-resistance path for power delivery. These planes are stitched together ... » read more

Distribution Of Currents In Via Arrays
By Siemens EDA - 24 May, 2023 - Comments: 0

It has become increasingly difficult in recent years to provide adequate PDNs on a PCB. The sheer number of different voltages, combined with increased current demands, makes distributing current around the board a substantial layout challenge. This paper demonstrates that by using appropriate and accurate simulations, combined with the improved intuition that such simulations bring, it is a ch... » read more

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