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Why Wafer Bumps Are Suddenly So Important


Wafer bumps need to be uniform in height to facilitate subsequent manufacturing steps, but a push for 100% inspection in packaging in mission-critical markets is putting a strain on existing measurement technologies. Bump co-planarity is essentially a measure of flatness. Specifically, it measures the variation in bump height, which may have a target, for example, of about 100 microns. As a ... » read more

Reliability Costs Becoming Harder To Track


Ensuring reliability in chips is becoming more complex and significantly more expensive, shifting left into the design cycle and right into the field. But those costs also are becoming more difficult to define and track, varying greatly from one design to the next based upon process node, package technology, market segment, and which fab or OSAT is used. As the number of options increases fo... » read more

Inspection And Metrology Of Micro LED Technology


Micro LEDs developed using Rohinni’s technology can be deployed in consumer electronics devices, automotive applications and outdoor signage, among other applications. The disruptive technology enables products that are brighter, thinner, lighter and more dynamic that those currently on the market, with lower power consumption than LCD or OLED. Rohinni needed an inspection and metrology so... » read more

Psst…Check This Out


By Katherine Derbyshire It’s hard to tell when the semiconductor industry actually changes over from one technology node to the next. Process technology is among the most closely guarded of fab secrets, and things like product sales numbers aren’t far behind. There are indirect measures, though. For example, the same device with a smaller feature size will have a smaller die size, and... » read more