tag: metrology

Inspection, Metrology Issues In Advanced Packages
By Gregory Haley - 08 Feb, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about how to inspect and measure smaller features across large areas in advanced packaging, with Frank Chen, director of applications and product management at Bruker Nano Surfaces & Metrology; John Hoffman, computer vision engineering manager at Nordson Test & Measurement; and Jiangtao Hu, senior technology director at O... » read more

Using FTIR To Improve SiC Power Device Performance
By Nick Keller - 09 Jan, 2024 - Comments: 0

The figures alone are impressive: SiC power devices are experiencing an annual average growth rate approaching 34% through 2027, according to the Yole Group. However, the potential for this amongst other compound semiconductor-based power devices such as gallium nitride (GaN) to change the world around us is even more impressive. Thanks to the role that SiC-based devices play in the increase... » read more

Closing The Test And Metrology Gap In 3D-IC Packages
By Gregory Haley - 12 Dec, 2023 - Comments: 0

The industry is investing in more precise and productive inspection and testing to enable advanced packages and eventually, 3D ICs. The next generations of aerospace, automotive, smartphone, and wearable tech most likely will be powered by multiple layers of intricately connected silicon, a stark departure from the planar landscapes of traditional integrated circuits. These 3D-ICs, compos... » read more

New Insights Into IC Process Defectivity
By Laura Peters - 07 Nov, 2023 - Comments: 1

Finding critical defects in manufacturing is becoming more difficult due to tighter design margins, new processes, and shorter process windows. Process marginality and parametric outliers used to be problematic at each new node, but now they are persistent problems at several nodes and in advanced packaging, where there may be a mix of different technologies. In addition, there are more proc... » read more

Addressing Trench Structures And Larger Wafers For Power Devices
By Vamsi Velidandla - 07 Nov, 2023 - Comments: 0

Wind power. Rail. Solar energy. And, perhaps most significantly, electric and hybrid vehicles. Together, these four forces are among the major demand drivers for power devices. While silicon (Si) still plays a role in power devices, wide-bandgap compound semiconductors like silicon carbide (SiC) and gallium nitride (GaN) are particularly well-suited for power devices thanks to their higher e... » read more

Tiny Dots, Big Impact: The Luminous World of Quantum Dots
By Xia Stammer - 07 Nov, 2023 - Comments: 0

In the early ’80s, Alexey Ekimov and Louis E. Brus independently researched semiconductor clusters, leading to the discovery of quantum dots (QDs). QDs are nanoscale semiconductor particles with unique optical and electronic properties. In 1993, Moungi Bawendi improved quantum dot production, making them nearly perfect for various applications. By the late ’90s and early 2000s, quantum d... » read more

Isolating Critical Data In Failure Analysis
By Anne Meixner - 01 Nov, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss traceability and the lack of data needed to perform root cause analysis with Frank Chen, director of applications and product management at Bruker Nano Surfaces & Metrology; Mike McIntyre, director of product management in the Enterprise Business Unit at Onto Innovation; Kamran Hakim, ASIC reliability engineer at Teradyne... » read more

Using Smart Data To Boost Semiconductor Reliability
By Laura Peters - 10 Oct, 2023 - Comments: 0

The chip industry is looking to AI and data analytics to improve yield, operational efficiency, and reduce the overall cost of designing and manufacturing complex devices. In fact, SEMI estimates its members could capture more than $60B in revenues associated through smart data use and AI. Getting there, however, requires overcoming a number of persistent obstacles. Smart data utilization is... » read more

Optimizing Metal Film Measurement On IGBT And MOSFET Power Devices With Picosecond Ultrasonic Technology
By Johnny Dai - 10 Oct, 2023 - Comments: 0

By Johnny Dai with Cheolkyu Kim and Priya Mukundhan In recent years, power semiconductor applications have expanded from industrial and consumer electronics to renewable energy and electric vehicles. Looking to the future, the most promising power semiconductor devices will be insulated gate bipolar transistor (IGBT) and power metal oxide semiconductor field effect transistor (power MOSFET) ... » read more

Streamlining Failure Analysis Of Chips
By Anne Meixner - 10 Oct, 2023 - Comments: 1

Experts at the Table: Semiconductor Engineering sat down to discuss how increasing complexity in semiconductor and packaging technology is driving shifts in failure analysis methods, with Frank Chen, director of applications and product management at Bruker Nano Surfaces & Metrology; Mike McIntyre, director of product management in the Enterprise Business Unit at Onto Innovation; Kamran Hak... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy