Blog Review: March 9

By Jesse Allen - 09 Mar, 2022 - Comments: 0

Arm's Ajay Joshi investigates how to select the right benchmark for CPUs used in the Home device market, such as digital television and set-top box/over-the-top devices. Ansys' Jon Kordell checks out how reliability physics simulations and physical component characterization can support component swapping in high-reliability applications when the original part is unavailable due to supply ch... » read more

Week In Review: Design, Low Power

By Jesse Allen - 04 Mar, 2022 - Comments: 0

Tools & IP Imperas Software introduced the RISC-V Verification Interface (RVVI). The open standard and methodology can be adapted to any configuration permitted within the RISC-V specifications. RVVI defines interfaces between RTL, reference model, and testbench for RISC-V design verification, with the aim of making RISC-V processor DV reusable. It supports multi-hart, superscalar, and out... » read more

A review of interconnect materials used in emerging memory device packaging: first- and second-level interconnect materials

By Technical Paper Link - 23 Dec, 2021 - Comments: 0

Abstract "The main motivation of this review is to study the evolution of first and second level of interconnect materials used in memory device semiconductor packaging. Evolutions of bonding wires from gold (Au) to silver (Ag) or copper (Cu) have been reported and studied in previous literatures for low-cost solution, but Au wire still gives highest rating in terms of the performance of tempe... » read more

Memory Technology: Innovations needed for continued technology scaling and enabling advanced computing systems

By Technical Paper Link - 03 Sep, 2021 - Comments: 0

Abstract: "An increasing demand for data generation, storage, and intelligence generation from data is driving advances in memory technology and advanced computing applications. Memory performance is starting to define modern day computing in both mobile and server environments. There is an absolute need to continue the tremendous pace of memory technology improvements to deliver performanc... » read more

What About Mask Rule Checking For Curvilinear Photomasks?

By Jan Willis - 22 Jul, 2021 - Comments: 0

The entire photomask design chain needs to be considered in the adoption of curvilinear photomasks. A broad look at the ecosystem impact was addressed in a previous video but a more in-depth look at the design chain of photomasks raises the next question – will MRC be harder and take more time? Aki Fujimura of D2S opens the nine-minute panel video with industry luminaries by providing a conce... » read more

Micron D1α, The Most Advanced Node Yet On DRAM

By Jeongdong Choe - 22 Jul, 2021 - Comments: 0

Finally, we got to see D1α DRAM generation! It’s 14nm! After a quick viewing of the Micron D1α die (die markings: Z41C) and its cell design, we have determined its actual technology node (design rule), in contrast to the claims of market literature. It is the most advanced technology node ever on DRAM, and it is the first sub-15nm cell integrated DRAM product. The Micron Z41C die removed... » read more

Developing A New Curvilinear Data Format

By Jan Willis - 17 Jun, 2021 - Comments: 0

The data size generated by curvilinear masks could impact turnaround time (TAT) for photomask production and hence the adoption of curvilinear masks. In a previous blog on curvilinear masks, our panel of luminaries discuss some possible solutions in a video discussion. In this seventh video, the panel looks at some ideas to define a new curvilinear data format to reduce file sizes. Aki Fujimura... » read more

Week In Review: Design, Low Power

By Jesse Allen - 04 Jun, 2021 - Comments: 0

Siemens Digital Industries Software acquired Nextflow Software, a provider of advanced particle-based computational fluid dynamics (CFD) solutions. Nextflow Software will become part of the Simcenter software portfolio, providing rapid meshless CFD capabilities to accelerate the analysis of complex transient applications in the automotive, aerospace, and marine industries such as gear box lubri... » read more

How Will The Adoption Of Curvilinear Masks Affect Turnaround Time?

By Jan Willis - 01 Jun, 2021 - Comments: 0

Turnaround time (TAT) for photomask makers has historically increased at smaller and smaller process nodes, as reported in the eBeam Initiative Mask Makers surveys, so it’s important to look at the impact of curvilinear masks on TAT. In this sixth installment of our blog series on curvilinear masks, Aki Fujimura of D2S explores this question with luminaries in the industry during a video pane... » read more

How Extensively Will Curvilinear ILT Be Used For EUV Photomasks?

By Jan Willis - 29 Apr, 2021 - Comments: 0

Curvilinear shapes on photomasks lead to improved process windows, as the first installment of this blog series discussed. Our blog series continues with a video panel discussion of the benefits that curvilinear shapes have for EUV photomasks (masks) and whether curvilinear shapes will be used beyond today’s usage for hotspots. Our panellists approached the question of curvilinear ILT for ... » read more

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tag: Micron Technology

Blog Review: March 9

Week In Review: Design, Low Power

A review of interconnect materials used in emerging memory device packaging: first- and second-level interconnect materials

Memory Technology: Innovations needed for continued technology scaling and enabling advanced computing systems

What About Mask Rule Checking For Curvilinear Photomasks?

Micron D1α, The Most Advanced Node Yet On DRAM

Developing A New Curvilinear Data Format

Week In Review: Design, Low Power

How Will The Adoption Of Curvilinear Masks Affect Turnaround Time?

How Extensively Will Curvilinear ILT Be Used For EUV Photomasks?

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