Week In Review, Manufacturing, Test


The U.S. is attempting to restrict sales of ASML’s deep ultra-violet (DUV) litho systems to China, according to a report from Bloomberg. The U.S. has been working to limit China's access to advanced technology for some time, and it has already limited sales of extreme ultra-violet (EUV), which is used to develop chips at the most advanced process nodes. DUV, in contrast, is used for older-nod... » read more

Week In Review: Design, Low Power


RISC-V RISC-V International announced four new specification and extension approvals. Efficient Trace for RISC-V defines an approach to processor tracing that uses a branch trace. RISC-V Supervisor Binary Interface architects a firmware layer between the hardware platform and the operating system kernel using an application binary interface in supervisor mode to enable common platform services... » read more

Week In Review: Design, Low Power


EnSilica listed on the London Stock Exchange's AIM market under the ticker ENSI. EnSilica designs mixed signal ASICs for system developers in the automotive, industrial, healthcare, and communications markets. It also has a portfolio of core IP covering cryptography, radar and communications systems. AIM is the LSE’s market for small and medium sized growth companies. "In connection with Admi... » read more

Shortages Spark Novel Component Lifecycle Solutions


The semiconductor industry’s supply chain problems are prompting some innovative solutions and workarounds, and while they don't solve all problems, they are improving efficiency and extending equipment lifetimes. The shortages, which affect everything from the chips used in automotive, IoT, and consumer ICs to the equipment used to manufacture and test them — span global supply lines. T... » read more

Week In Review: Manufacturing, Test


Photonic Chips Go Big In Europe PhotonDelta, a collaborative end-to-end supply chain for the application of photonics chips, secured €1.1 billion in conditional funding for a six-year initiative. Investments from the Netherlands government and other organizations “will be used to build 200 startups, scale up production, create new applications for photonic chips, and develop infrastructure... » read more

Week In Review: Manufacturing, Test


Deals AMD plans to purchase cloud startup Pensando for about US $1.9 billion. In a presentation at the SEMI ISS conference this week, AMD CTO Mark Papermaster described Pensando's technology as a "highly programmable packet-processing engine that allows you to speed up systems designed for the data center." Intel, Micron, Analog Devices and MITRE Engenuity formed an alliance to accelerate c... » read more

Week In Review: Design, Low Power


Synopsys and Juniper Networks are forming a new, separate company that will provide the industry with an open silicon photonics platform that will include integrated lasers, optical amplifiers, and a full suite of photonic components to form a complete solution that will be accessible through a Process Design Kit (PDK). The new company is being formed, in part, from the carve-out of integrated ... » read more

Week In Review: Manufacturing, Test


Worldwide fab equipment spending for front-end manufacturing is expected to hit $107 billion this year, an 18% year-over-year increase, according to SEMI’s latest World Fab Forecast report. “Crossing the $100 billion mark in spending on global fab equipment for the first time is a historic milestone for the semiconductor industry,” said Ajit Manocha, president and CEO of SEMI. Investme... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive Suzuki will collaborate with SkyDrive on flying cars. SkyDrive is working on an air taxi service that it wants to launch at the 2025 World Exposition in Osaka, Japan. Recalls: The car company Tesla is recalling 947 vehicles in the United States because rearview image lags and does not display immediately when the car is put into reverse, said the National Highway Traffic Safety A... » read more

Week In Review: Manufacturing, Test


Chipmakers, OEMs UMC plans to build a new fab next to its existing 300mm fab in Singapore. The new fab, called Fab12i P3, will manufacture wafers based on UMC’s 22nm/28nm processes. The planned investment for this project will be $5 billion. The first phase of this greenfield fab will have a monthly capacity of 30,000 wafers with production expected to commence in late 2024. To account fo... » read more

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