Technical Paper Round-up: June 14


New technical papers added to Semiconductor Engineering’s library this week. [table id=33 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit f... » read more

MIT: Stackable AI Chip With Lego-style Design


New technical paper titled "Reconfigurable heterogeneous integration using stackable chips with embedded artificial intelligence" from researchers at MIT, along with Harvard University, Tsinghua University, Zhejiang University, and others. Partial Abstract: "Here we report stackable hetero-integrated chips that use optoelectronic device arrays for chip-to-chip communication and neuromorphic... » read more

Technical Paper Round-up: May 17


New technical papers added to Semiconductor Engineering’s library this week. [table id=27 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a go... » read more

MIT Researchers Create Thin-Film Speakers


New academic paper from MIT, "An Ultra-Thin Flexible Loudspeaker Based on a Piezoelectric Micro-Dome Array." Abstract: "Ultra-thin, lightweight, high-performance, low-cost and energy-efficient loudspeakers that can be deployed over a wide area have become increasingly attractive to both traditional audio systems and emerging applications such as active noise control and immersive entertainm... » read more

Technical Paper Round-up: April 26


Find all technical papers in Semiconductor Engineering’s library. [table id=23 /]   Semiconductor Engineering is in the process of building this library of research papers.  Please send suggestions for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a ... » read more

Stress tensor mesostructures for deterministic figuring of thin substrates


New research paper from MIT and University of Arizona, funded by NASA. Abstract "Accessing the immense value of freeform surfaces for mass-sensitive applications such as space optics or metaform optical components requires fabrication processes that are suited to figuring thin substrates. We present stress tensor mesostructures for precisely correcting figure errors, even after microstruc... » read more

Technical Paper Round-Up: April 19


New technical papers include selective etching, ISO 26262 test bench, hardware accelerators, RISC-V, lidar, EUV mask inspection, fault attacks, edge computing, gallium oxide, and machine learning for VLSI CAD-on-chip power grid design. Cutting-edge research is now a global effort. It extends from the U.S. Air Force, to schools such as MIT, and universities in Italy, Spain, Portugal, India, K... » read more

Selective etching of silicon nitride over silicon oxide using ClF3 /H2 remote plasma


Researchers from Sungkyunkwan University, MIT and others present an option for selective etching. Abstract "Precise and selective removal of silicon nitride (SiNx) over silicon oxide (SiOy) in a oxide/nitride stack is crucial for a current three dimensional NOT-AND type flash memory fabrication process. In this study, fast and selective isotropic etching of SiNx over SiOy has been investiga... » read more

Academic Research Paper Round-Up: April 13


The volume of research into advanced semiconductors is rising and widening. The latest batch includes hybrid power-gating architecture, RRAM devices models, improved FMEA, quantum machine learning, enhanced nonlinear optics, harvesting energy after sundown, direct chemisorption-assisted nanotransfer printing, and more. Topping the list of researchers this week are ETH Zurich, Stanford Unive... » read more

Week In Review: Manufacturing, Test


The U.S. Senate approved the 2022 America COMPETES act, which has big ramifications for the chip industry. The bill now heads to the House for further reconciliation. If approved, it would provide more than $50 billion in U.S. subsidies for semiconductor chip manufacturing. The SIAC (Semiconductor In America Coalition) urged Congress to act promptly to achieve a bipartisan compromise soon and o... » read more

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