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Nanosheet GeSn pTFTs: High Performance, Low Thermal Budget


New technical paper titled "Remarkably High-Performance Nanosheet GeSn Thin-Film Transistor" from researchers at National Yang Ming Chiao Tung University and others. Abstract "High-performance p-type thin-film transistors (pTFTs) are crucial for realizing low-power display-on-panel and monolithic three-dimensional integrated circuits. Unfortunately, it is difficult to achieve a high hole ... » read more

3D-IC Design Challenges And Requirements


As demands accelerate for increasing density, higher bandwidths, and lower power, many IC design and packaging teams are taking a close look at vertical stacking multiple chips and chiplets. This technology, called 3D-IC, promises many advantages over traditional single-die planar designs. Some are using the term “More-than-Moore” to describe the potential of this new technology. Integratio... » read more

The Search For The Next Transistor


In the near term, the leading-edge chip roadmap looks fairly clear. Chips based on today’s finFETs and planar fully depleted silicon-on-insulator (FDSOI) technologies are expected to scale down to the 10nm node. But then, the CMOS roadmap becomes foggy at 7nm and beyond. The industry has been exploring a number of next-generation transistor candidates, but suddenly, a few technologies are ... » read more

Leti Outlines FDSOI And Monolithic 3D IC Roadmaps


Semiconductor Engineering discussed the future roadmaps for fully depleted silicon-on-insulator (FDSOI) technology and monolithic 3D chips with Maud Vinet, manager for the Innovative Devices Laboratory at CEA-Leti. SE: What are some of the technologies being developed at the Innovative Devices Laboratory? Vinet: The Innovative Devices Laboratory is involved with advanced CMOS. So basically... » read more

Momentum Builds For Monolithic 3D ICs


The 2.5D/3D chip market is heating up on several fronts. On one front, stacked-die using through-silicon vias (TSVs) is taking root. In a separate area, Samsung is sampling the world’s first 3D NAND device, with Micron and SK Hynix expected to follow suit. And now, there is another technology generating steam—monolithic 3D integrated circuits. In stacked-die, bare die are connected using... » read more