Chip Industry’s Technical Paper Roundup: Apr. 10


New technical papers recently added to Semiconductor Engineering’s library: [table id=92 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us p... » read more

Ferroelectric Polarization in an Elementary Substance or Single-Element Compound


A technical paper titled "Two-dimensional ferroelectricity in a single-element bismuth monolayer" was published by researchers at National University of Singapore, Zhejiang University, Tianjin University, and University of Chinese Academy of Sciences. Abstract "Ferroelectric materials are fascinating for their non-volatile switchable electric polarizations induced by the spontaneous inversi... » read more

Week In Review: Manufacturing, Test


TEL announced plans to build a ¥2.2 billion ($168.2 million) production and logistics center at its Tohoku Office to increase capacity. Construction of the 57,000m² facility, which will be used for manufacturing thermal processing and single-wafer deposition systems, is slated to start in spring 2024, and expected to be completed in fall 2025. Toshiba's board voted in favor of a 2 trillio... » read more

Technical Paper Roundup: Sept 27


New technical papers added to Semiconductor Engineering’s library this week. [table id=53 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit f... » read more

Implementations of 2D Material-Based Devices For IoT Security


A new research paper titled "Application of 2D Materials in Hardware Security for Internet-of-Things: Progress and Perspective" was published by researchers at National University of Singapore and A*STAR. The paper explores the "implementation of hardware security using 2D materials, for example, true random number generators (TRNGs), physical unclonable functions (PUFs), camouflage, and ant... » read more

Security Research: Technical Paper Round-Up


A number of hardware security-related technical papers were presented at recent conferences, including the August 2022 USENIX Security Symposium and IEEE’s International Symposium on Hardware Oriented Security and Trust (HOST). Topics include side-channel attacks and defenses (including on-chip mesh interconnect attacks), heterogeneous attacks on cache hierarchies, rowhammer attacks and mitig... » read more

Using GPUs to Speed Up DFIT Analysis


Researchers at National University of Singapore and an independent researcher presented a new technical paper titled "FlowMatrix: GPU-Assisted Information-Flow Analysis through Matrix-Based Representation" at the USENIX Security Symposium in Boston in August 2022. Abstract: "Dynamic Information Flow Tracking (DIFT) forms the foundation of a wide range of security and privacy analyses. The ... » read more

Week in Review: Auto, Security, Pervasive Computing


Automotive and Mobility Search engine giant Baidu said Monday it is the first company to secure permits to operate robotaxis in China without a human safety driver. Baidu’s Apollo and Toyota-backed Pony.ai already operate robotaxis with backup drivers in Beijing. Also this week, smartphone maker Xiaomi said it is running autonomous driving tests on 140 vehicles in China. Xiaomi announced it ... » read more

Technical Paper Round-Up: June 8


  New technical papers added to Semiconductor Engineering’s library this week. [table id=32 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a ... » read more

Scalable Approach to Fabricate Memristor Arrays at Wafer-scale


New technical paper titled "Wafer-scale solution-processed 2D material analog resistive memory array for memory-based computing" from researchers at National University of Singapore and Institute of High Performance Computing, Singapore. Abstract "Realization of high-density and reliable resistive random access memories based on two-dimensional semiconductors is crucial toward their develop... » read more

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