The Challenges Of Building Inferencing Chips

By Ann Mutschler - 27 Feb, 2020 - Comments: 0

Putting a trained algorithm to work in the field is creating a frenzy of activity across the chip world, spurring designs that range from purpose-built specialty processors and accelerators to more generalized extensions of existing and silicon-proven technologies. What's clear so far is that no single chip architecture has been deemed the go-to solution for inferencing. Machine learning is ... » read more

The Next New Memories

By Mark LaPedus - 15 Aug, 2019 - Comments: 2

Several next-generation memory types are ramping up after years of R&D, but there are still more new memories in the research pipeline. Today, several next-generation memories, such as MRAM, phase-change memory (PCM) and ReRAM, are shipping to one degree or another. Some of the next new memories are extensions of these technologies. Others are based on entirely new technologies or involve ar... » read more

Controlling Variability And Cost At 3nm And Beyond

By Ed Sperling - 22 May, 2019 - Comments: 1

Richard Gottscho, executive vice president and CTO of Lam Research, sat down with Semiconductor Engineering to talk about how to utilize more data from sensors in manufacturing equipment, the migration to new process nodes, and advancements in ALE and materials that could have a big impact on controlling costs. What follows are excerpts of that conversation. SE: As more sensors are added int... » read more

System Bits: May 6

By Jeff Dorsch - 06 May, 2019 - Comments: 0

Transmitting data with a semiconductor laser Researchers at the Harvard John A. Paulson School of Engineering and Applied Sciences demonstrated a laser that can emit microwaves wirelessly, modulate them, and receive external radio frequency signals. “The research opens the door to new types of hybrid electronic-photonic devices and is the first step toward ultra-high-speed Wi-Fi,” said ... » read more

Multiple Approaches To Memory Challenges

By Ryan Gibson - 21 Feb, 2019 - Comments: 0

As we enter the era of Big Data and Artificial Intelligence (AI), it is amazing to think about the possibilities for a truly seismic shift in the changing requirements for memory solutions. The massive amount of data humans generate every year is astounding and yet is expected to increase five-fold in the next few years from machine-generated data. Further compounding this growth is the emergin... » read more

What’s Next For AI, Quantum Chips

By Mark LaPedus - 24 Jan, 2019 - Comments: 1

Semiconductor Engineering sat down to discuss the latest R&D trends with Luc Van den hove, president and chief executive of Imec; Emmanuel Sabonnadière, chief executive of Leti; and An Chen, executive director for the Nanoelectronics Research Initiative at the Semiconductor Research Corp. (SRC). Chen is on assignment from IBM. What follows are excerpts of those conversations, which took pl... » read more

The Next Semiconductor Revolution

By Ed Sperling - 15 Jan, 2019 - Comments: 0

What will drive the next semiconductor revolution? When you ask people with decades of experience in semiconductor manufacturing and software development, the answers include everything from AI and materials to neuromorphic architectures. Federico Faggin, designer of the world's first microprocessor; Terry Brewer, president and CEO of Brewer Science; Sanjay Natarajan, corporate vice presi... » read more

Power/Performance Bits: Dec. 26

By Jesse Allen - 26 Dec, 2018 - Comments: 0

2nm memristors Researchers at the University of Massachusetts Amherst and Brookhaven National Laboratory built memristor crossbar arrays with a 2nm feature size and a single-layer density up to 4.5 terabits per square inch. The team says the arrays were built with foundry-compatible fabrication technologies. "This work will lead to high-density memristor arrays with low power consumption fo... » read more

Making AI Run Faster

By Ed Sperling - 11 Oct, 2018 - Comments: 0

The semiconductor industry has woken up to the fact that heterogeneous computing is the way forward and that inferencing will require more than a GPU or a CPU. The numbers being bandied about by the 30 or so companies working on this problem are 100X improvements in performance. But how to get there isn't so simple. It requires four major changes, as well as some other architectural shifts. ... » read more

Betting Big On Discontinuity

By Ed Sperling - 27 Sep, 2018 - Comments: 0

Wally Rhines, president and CEO of Mentor, a Siemens Business, sat down with Semiconductor Engineering to talk about the booming chip industry, what's driving it, how long it will last and what changes are ahead in EDA and chip architectures. What follows are excerpts of that conversation. SE: The EDA and semiconductor industries are doing well right now. What's driving that growth? Rhine... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

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3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

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The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

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Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

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Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

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tag: neuromorphic computing