tag: NIST

Technical Paper Round-Up: April 5
By Linda Christensen - 05 Apr, 2022 - Comments: 0

Neuromorphic chips, transistor defect detection, quantum, pellicles, BEV mobile charging, copper wire bonding, LrWPAN, batteries and superconductivity top the past week's technical papers. They also point to a rising level of government investment, and collaborations between schools that historically haven't worked closely together, including one that involves schools on different continents. ... » read more

NIST Modifies & Improves Technique For Detecting Transistor Defects
By Technical Paper Link - 04 Apr, 2022 - Comments: 0

Abstract "We utilize a frequency-modulated charge pumping methodology to measure quickly and conveniently single “charge per cycle” in highly scaled Si/SiO2 metal–oxide–semiconductor field effect transistors. This is indicative of detection and manipulation of a single interface trap spin species located at the boundary between the SiO2 gate dielectric and Si substrate (almost certainl... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 04 Mar, 2022 - Comments: 0

Packaging ASE, AMD, Arm, Google, Intel, Meta, Microsoft, Qualcomm, Samsung, and TSMC have announced the formation of a consortium that will establish a die-to-die interconnect standard and foster an open chiplet ecosystem. The founding companies also ratified the UCIe specification, an open industry standard developed to establish a standard interconnect at the package level. The UCIe 1.0 s... » read more

Making PUFs Even More Secure
By Bryon Moyer - 06 Jan, 2022 - Comments: 0

As security has become a must-have in most systems, hardware roots of trust (HRoTs) have started appearing in many chips. Critical to an HRoT is the ability to authenticate and to create keys – ideally from a reliable source that is unviewable and immutable. “We see hardware roots of trust deployed in two use models — providing a foundation to securely start a system, and enabling a se... » read more

Manufacturing Bits: Dec. 28
By Mark LaPedus - 28 Dec, 2021 - Comments: 1

Measuring microdroplets The National Institute of Standards and Technology (NIST) has found a new way for microscopes to measure the volumes of microdroplets. Using this technique, NIST has measured the volume of individual droplets smaller than 100 trillionths of a liter with an uncertainty of less than 1%. That represents a tenfold improvement compared to previous measurements, according ... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 23 Dec, 2021 - Comments: 0

NASA plans to launch the James Webb Space Telescope (JWST) this Saturday, Dec 25, on an European Space Agency (ESA) rocket. Mission-critical radiation-hardened components from IR HiRel, an Infineon company, will go up with the JWST. IR HiRel space-grade DC-DC converters, rad hard MOSFETs and other power control products are in the spacecraft bus subsystems, such as electrical power, altitude co... » read more

Why It’s So Difficult — And Costly — To Secure Chips
By Ed Sperling - 02 Dec, 2021 - Comments: 0

Rising concerns about the security of chips used in everything from cars to data centers are driving up the cost and complexity of electronic systems in a variety of ways, some obvious and others less so. Until very recently, semiconductor security was viewed more as a theoretical threat than a real one. Governments certainly worried about adversaries taking control of secure systems through... » read more

Considerations for Neuromorphic Supercomputing in Semiconducting and Superconducting Optoelectronic Hardware
By Technical Paper Link - 18 Nov, 2021 - Comments: 0

Abstract: "Any large-scale spiking neuromorphic system striving for complexity at the level of the human brain and beyond will need to be co-optimized for communication and computation. Such reasoning leads to the proposal for optoelectronic neuromorphic platforms that leverage the complementary properties of optics and electronics. Starting from the conjecture that future large-scale neurom... » read more

Complex Chips Make Security More Difficult
By John Koon - 04 Nov, 2021 - Comments: 0

Semiconductor supply chain management is becoming more complex with many more moving parts as chips become increasingly disaggregated, making it difficult to ensure where parts originated and whether they have been compromised before they are added into advanced chips or packages. In the past, supply chain concerns largely focused primarily on counterfeit parts or gray-market substitutions u... » read more

Power/Performance Bits: Oct. 26
By Jesse Allen - 26 Oct, 2021 - Comments: 0

Printing circuits on irregular shapes Researchers at Pennsylvania State University propose a way to print biodegradable circuits on irregular, complex shapes. “We are trying to enable direct fabrication of circuits on freeform, 3-D geometries,” said Huanyu “Larry” Cheng, professor in Penn State's Department of Engineering Science and Mechanics (ESM). “Printing on complicated objec... » read more

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