tag: NIST

Week In Review: Design, Low Power
By Jesse Allen - 20 May, 2022 - Comments: 0

Cadence's digital full flow was certified for the GlobalFoundries 12LP/12LP+ process platforms. The certified tools include the Innovus Implementation System, Genus Synthesis Solution, Tempus Timing Signoff Solution, Voltus IC Power Integrity Solution, Quantus Extraction Solution, Litho Physical Analyzer (LPA), and Pegasus Verification System. Siemens Digital Industries Software's Calibre nm... » read more

Technical Paper Round-up: May 17
By Linda Christensen - 17 May, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=27 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a go... » read more

Silicon Verified ASIC Implementation for Saber
By Technical Paper Link - 13 May, 2022 - Comments: 0

New research paper from Purdue University, KU Leuven, and Intel Labs titled "A 334uW 0.158mm2 Saber Learning with Rounding based Post-Quantum Crypto Accelerator." Abstract: "National Institute of Standard & Technology (NIST) is currently running a multi-year-long standardization procedure to select quantum-safe or post-quantum cryptographic schemes to be used in the future. Saber is the... » read more

Measuring Frequency Dependence Across 5G mmWave Bands (NIST)
By Technical Paper Link - 10 May, 2022 - Comments: 0

New research paper from NIST, "Methodology for Measuring the Frequency Dependence of Multipath Channels Across the Millimeter-Wave Spectrum." Abstract "Millimeter-wave (mmWave) communications promise Gigabit/s data rates thanks to the availability of large swaths of bandwidth between 10–100 GHz. Although cellular operators prefer the lower portions of the spectrum due to popular belief ... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 06 May, 2022 - Comments: 0

Automotive, mobility Stellantis is buying Share Now, a car sharing service owned by BMW and Mercedes-Benz. Through the acquisition, Stellantis will be adding 3.4 million car sharing customers, 10,000 vehicles, and 14 new European cities to its Free2move car sharing service, which currently has 2 million users, 2,500 vehicles, and has 7 “mobility hubs” in the U.S. and Europe. ShareNow was a... » read more

Data-driven RRAM device models using Kriging interpolation
By Technical Paper Link - 10 Apr, 2022 - Comments: 0

New technical paper from The George Washington University and NIST with support from DARPA and others. Abstract "A two-tier Kriging interpolation approach is proposed to model jump tables for resistive switches. Originally developed for mining and geostatistics, its locality of the calculation makes this approach particularly powerful for modeling electronic devices with complex behavior la... » read more

Complex Chips Make Security More Difficult
By John Koon - 07 Apr, 2022 - Comments: 0

Semiconductor supply chain management is becoming more complex with many more moving parts as chips become increasingly disaggregated, making it difficult to ensure where parts originated and whether they have been compromised before they are added into advanced chips or packages. In the past, supply chain concerns largely focused primarily on counterfeit parts or gray-market substitutions u... » read more

Technical Paper Round-Up: April 5
By Linda Christensen - 05 Apr, 2022 - Comments: 0

Neuromorphic chips, transistor defect detection, quantum, pellicles, BEV mobile charging, copper wire bonding, LrWPAN, batteries and superconductivity top the past week's technical papers. They also point to a rising level of government investment, and collaborations between schools that historically haven't worked closely together, including one that involves schools on different continents. ... » read more

NIST Modifies & Improves Technique For Detecting Transistor Defects
By Technical Paper Link - 04 Apr, 2022 - Comments: 0

Abstract "We utilize a frequency-modulated charge pumping methodology to measure quickly and conveniently single “charge per cycle” in highly scaled Si/SiO2 metal–oxide–semiconductor field effect transistors. This is indicative of detection and manipulation of a single interface trap spin species located at the boundary between the SiO2 gate dielectric and Si substrate (almost certainl... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 04 Mar, 2022 - Comments: 0

Packaging ASE, AMD, Arm, Google, Intel, Meta, Microsoft, Qualcomm, Samsung, and TSMC have announced the formation of a consortium that will establish a die-to-die interconnect standard and foster an open chiplet ecosystem. The founding companies also ratified the UCIe specification, an open industry standard developed to establish a standard interconnect at the package level. The UCIe 1.0 s... » read more

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