tag: NXP

In-Vehicle Networks Are Safety, Security Dependent
By Ann Mutschler - 05 Jan, 2017 - Comments: 0

It’s clear that managing, defining and prioritizing data traffic within vehicles is becoming an enormous challenge particularly with the growing number of networks , and underpining it all are safety and security concerns. Rob Knoth, product management director for the DSG group at Cadence observed, “The more you try to integrate traffic onto one bus, the more you are exposing systems th... » read more

The Week In Review: Design
By Jesse Allen - 16 Dec, 2016 - Comments: 0

IP eSilicon launched 14nm FinFET and 28nm planar HBM Gen2 Hardened PHY. It supports up to 256Gbytes/sec bandwidth with 8x128b channels at 2Gbps per I/O, and the integrated I/O supports up to 2Gbps DDR operation across a 4mm interposer channel. The PHY was developed on Samsung 14LPP and TSMC 28HPC technologies. Flex Logix designed a high-performance embedded FPGA IP core for TSMC 16FF+ and... » read more

Blog Review: Dec. 14
By Jesse Allen - 14 Dec, 2016 - Comments: 0

What are the technology options for 5nm? Cadence's Paul McLellan highlights an IEDM presentation by An Steegen of Imec. Synopsys' Michael Posner suggests we may not have to live with USB Type-C dongles for very long. Mentor's Craig Armenti presents some of the fundamental best practices and guidelines for rigid-flex PCB design. NXP's Joe Byrne digs into the Mirai botnet attack, arguing... » read more

Blog Review: Dec. 7
By Jesse Allen - 07 Dec, 2016 - Comments: 0

Mentor's Harry Foster looks at verification results findings in terms of schedules, number of required spins, and classification of functional bugs, in the latest installment of the Wilson Research Group verification study. Cadence's Paul McLellan provides an overview of the portable stimulus standard currently being worked on at Accellera. Synopsys' Anika Malhotra checks out JESD204B, a ... » read more

The Week In Review: Design
By Jesse Allen - 02 Dec, 2016 - Comments: 0

Deals Kilopass extended its deal with ICScape, which makes a Parallel SPICE simulator, for eNVM IP at advanced finFET nodes. Kilopass has been working with ICScape for the past couple of years as part of its qualification methodology. IP Silvaco released three MIPI I3C sensor controller IP cores. Developed with NXP to push adoption of I3C, the new products are an Advanced Slave core wi... » read more

Harder Than It Looks
By Ed Sperling - 01 Dec, 2016 - Comments: 0

First Apple scales back plans to develop its own vehicle. Then Intel creates its own automotive chip unit. This kind of two-step movement in the automotive electronics industry is becoming more common. NXP buys Freescale, then Qualcomm buys NXP. Harman buys Symphony Teleca and Red Bend Software, then Samsung buys Harman. All of these moves are proof points that innovation and fleet-foo... » read more

Blog Review: Nov. 30
By Jesse Allen - 30 Nov, 2016 - Comments: 0

Cadence's Paul McLellan presents a three-part series on the future of EDA, with insights from both academia and industry. Mentor's Harry Foster focuses on power management trends in ASIC design, in the latest installment of the 2016 Wilson Research Group verification study. Plus, what aspects of power are verified and how designers describe power intent. Synopsys' Robert Vamosi reports th... » read more

Blog Review: Nov. 23
By Jesse Allen - 23 Nov, 2016 - Comments: 0

Mentor's Brian Derrick argues that both designers and ecosystems are changing to leverage advances in sensing technology at the edge of the IoT. Cadence's Paul McLellan listens in on a DVCon Europe keynote by NXP's Jürgen Weyer on what automotive is learning from mobile and where the big challenges lie. Synopsys' Tumuluri SantoshaLakshmi talks about seven of the biggest challenges in JED... » read more

New Wave Of Consolidation
By Ed Sperling - 22 Nov, 2016 - Comments: 0

Consolidation is picking up again across the semiconductor industry, against a backdrop of looming interest rate hikes, geopolitical uncertainty, and the erosion of longstanding demarcations between markets. In the past couple of weeks, Siemens signed a deal to buy [getentity id="22017" e_name="Mentor Graphics"] for $4 billion, and [getentity id="22865" e_name="Samsung"] purchased Harman, a ... » read more

Printed Cars, Smart Stints, Personal Breathalyzers
By Joanne Itow - 21 Nov, 2016 - Comments: 0

The MEMS and sensor market continues to be a hotbed for innovation, new opportunities and, as with most new frontiers, there are also some disparate views on market dynamics and strategies. All this was evident at the 2016 MSIG Executive Congress last week in Scottsdale, Arizona. First, I’ll cover the pioneering and fun subjects. In addition to the Technology Showcase demos and member pres... » read more

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