Improving Performance And Power With HBM3


HBM3 swings open the door to significantly faster data movement between memory and processors, reducing the power it takes to send and receive signals and boosting the performance of systems where high data throughput is required. But using this memory is expensive and complicated, and that likely will continue to be the case in the short term. High Bandwidth Memory 3 (HBM3) is the most rece... » read more

Designing And Securing Chips For Outer Space


Design considerations for hardware used in space go far beyond radiation hardening. These devices have to perform flawlessly for years, under extreme temperature variations, and potentially banged up by space junk or other particles floating in the void over its projected lifetime. Reliability in space adds a whole different set of design considerations. For example, while it's unlikely anyo... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive, mobility Siemens Digital Industries Software and climate-tech company sustamize devised a way to add carbon emissions data to Siemens Xcelerator. Siemens created its Teamcenter Carbon Footprint Calculator software to help teams measure, simulate, reduce, and track their product carbon footprint early in the development phase. The calculator uses sustamize’s Product Footprint Engi... » read more

AlphaGo Game Influences Argonne’s New AI Tool For Materials Discovery


Research paper titled "Learning in continuous action space for developing high dimensional potential energy models" from researchers at Argonne National Lab with contributions from Oak Ridge National Laboratory. Abstract "Reinforcement learning (RL) approaches that combine a tree search with deep learning have found remarkable success in searching exorbitantly large, albeit discrete action ... » read more

Week In Review: Design, Low Power


Tools, IP, chips Synopsys unveiled a new data-visibility and machine intelligence-guided design optimization solution. DesignDash is complementary to the company's DSO.ai AI-driven design-space-optimization tool and provides a real-time, unified, 360-degree view of all design activities. It uses deep analytics and machine learning to extract and reveal actionable understanding from large amoun... » read more

Week In Review: Manufacturing, Test


Worldwide fab equipment spending for front-end manufacturing is expected to hit $107 billion this year, an 18% year-over-year increase, according to SEMI’s latest World Fab Forecast report. “Crossing the $100 billion mark in spending on global fab equipment for the first time is a historic milestone for the semiconductor industry,” said Ajit Manocha, president and CEO of SEMI. Investme... » read more

Chiplets Enter The Supercomputer Race


Several entities from various nations are racing each other to deliver and deploy chiplet-based exascale supercomputers, a new class of systems that are 1,000x faster than today’s supercomputers. The latest exascale supercomputer CPU and GPU designs mix and match complex dies in advanced packages, adding a new level of flexibility and customization for supercomputers. For years, various na... » read more

Manufacturing Bits: Feb. 15


Strong plastics The Massachusetts Institute of Technology has developed a new material that is stronger than steel but is light as plastic. The new material, which can be made in large quantities, involves a two-dimensional polymer that self-assembles into sheets. The material’s Young modulus—or a measure of how much force it takes to deform a material—is between four and six times gr... » read more

Manufacturing Bits: Feb. 7


Design tools for solid-state batteries Oak Ridge National Laboratory has devised a new tool designed to accelerate the development of energy-dense solid-state batteries. The tool, called the Solid-State Battery Performance Analyzer and Calculator (SolidPAC), enables researchers to assess the impact of battery designs and choice of cell components for solid-state batteries. It can be used to... » read more

Week In Review: Manufacturing, Test


Chipmakers China’s Tsinghua Unigroup is in trouble. The group is the parent company of China’s YMTC, a 3D NAND supplier, and other chip ventures. It is close to moving into bankruptcy proceedings. Now, a consortium led by Alibaba has emerged as the frontrunner to take over Tsinghua Unigroup, according to a report from Bloomberg. That deal would keep the company afloat, the report said. ... » read more

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