tag: Oak Ridge National Laboratory

Week In Review: Design, Low Power
By Karen Heyman - 26 May, 2023 - Comments: 0

Cadence bought Pulsic, a U.K.-based developer of place-and-route tools for custom digital and analog. The acquisition follows a previous acquisition attempt by a Chinese firm in August 2022, which was blocked by the U.K. government. At the G7 Summit in Japan, IBM announced a 10-year, $100 million initiative with the University of Tokyo and the University of Chicago to develop a quantum-centr... » read more

Research Bits: May 10
By Jesse Allen - 10 May, 2023 - Comments: 0

Growing 2D TMDs on chips Researchers from Massachusetts Institute of Technology (MIT), Oak Ridge National Laboratory, and Ericsson Research found a way to “grow” layers of 2D transition metal dichalcogenide (TMD) materials directly on top of a fully fabricated silicon chip, a technique they say could enable denser integrations. The researchers focused on molybdenum disulfide, which is f... » read more

Chip Industry’s Technical Paper Roundup: May 8
By Linda Christensen - 08 May, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=102 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us... » read more

Week In Review: Design, Low Power
By Jesse Allen - 14 Apr, 2023 - Comments: 0

Arm and Intel Foundry Services inked a multi-generation agreement to enable chip designers to build Arm-based SoCs on the Intel 18A process. The initial focus is mobile SoC designs, but the deal allows for potential expansion into automotive, IoT, data center, aerospace, and government applications. IFS and Arm will undertake design technology co-optimization (DTCO) to optimize chip design and ... » read more

Improving Performance And Power With HBM3
By Andy Patrizio - 30 Jan, 2023 - Comments: 0

HBM3 swings open the door to significantly faster data movement between memory and processors, reducing the power it takes to send and receive signals and boosting the performance of systems where high data throughput is required. But using this memory is expensive and complicated, and that likely will continue to be the case in the short term. High Bandwidth Memory 3 (HBM3) is the most rece... » read more

Designing And Securing Chips For Outer Space
By Marie C. Baca - 19 Dec, 2022 - Comments: 2

Design considerations for hardware used in space go far beyond radiation hardening. These devices have to perform flawlessly for years, under extreme temperature variations, and potentially banged up by space junk or other particles floating in the void over its projected lifetime. Reliability in space adds a whole different set of design considerations. For example, while it's unlikely anyo... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 23 Sep, 2022 - Comments: 0

Automotive, mobility Siemens Digital Industries Software and climate-tech company sustamize devised a way to add carbon emissions data to Siemens Xcelerator. Siemens created its Teamcenter Carbon Footprint Calculator software to help teams measure, simulate, reduce, and track their product carbon footprint early in the development phase. The calculator uses sustamize’s Product Footprint Engi... » read more

AlphaGo Game Influences Argonne’s New AI Tool For Materials Discovery
By Technical Paper Link - 10 Jun, 2022 - Comments: 0

Research paper titled "Learning in continuous action space for developing high dimensional potential energy models" from researchers at Argonne National Lab with contributions from Oak Ridge National Laboratory. Abstract "Reinforcement learning (RL) approaches that combine a tree search with deep learning have found remarkable success in searching exorbitantly large, albeit discrete action ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 03 Jun, 2022 - Comments: 0

Tools, IP, chips Synopsys unveiled a new data-visibility and machine intelligence-guided design optimization solution. DesignDash is complementary to the company's DSO.ai AI-driven design-space-optimization tool and provides a real-time, unified, 360-degree view of all design activities. It uses deep analytics and machine learning to extract and reveal actionable understanding from large amoun... » read more

Week In Review: Manufacturing, Test
By Ed Sperling - 25 Mar, 2022 - Comments: 0

Worldwide fab equipment spending for front-end manufacturing is expected to hit $107 billion this year, an 18% year-over-year increase, according to SEMI’s latest World Fab Forecast report. “Crossing the $100 billion mark in spending on global fab equipment for the first time is a historic milestone for the semiconductor industry,” said Ajit Manocha, president and CEO of SEMI. Investme... » read more

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