Chip Industry Week In Review

By The SE Staff - 12 Jan, 2024 - Comments: 0

By Jesse Allen, Karen Heyman, and Liz Allan Renesas will acquire Transphorm, which designs and manufactures gallium nitride power devices, for about $339 million. GaN, which is a wide-bandgap technology, is used for high-voltage applications in a slew of markets, including EVs and EV fast chargers, as well as data centers and industrial applications. Cadence acquired Invecas, a provider o... » read more

Chip Industry’s Technical Paper Roundup: May 16

By Linda Christensen - 16 May, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=103 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us... » read more

Toolbox For Designing Heterogeneous Quantum Systems

By Technical Paper Link - 08 May, 2023 - Comments: 0

A new technical paper titled "Microarchitectures for Heterogeneous Superconducting Quantum Computers" was published by researcher at: Pacific Northwest National Laboratory, Princeton University, University of Chicago, Rutgers University, MIT, Brookhaven National Laboratory, and Infleqtion. Abstract: "Noisy Intermediate-Scale Quantum Computing (NISQ) has dominated headlines in recent years, ... » read more

Chip Industry’s Technical Paper Roundup: Jan. 17

By Linda Christensen - 17 Jan, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library. [table id=74 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us posting li... » read more

New Technique For Making Thin Films of Perovskite Oxide Semiconductors

By Technical Paper Link - 06 Jan, 2023 - Comments: 0

A technical paper titled "Freestanding epitaxial SrTiO3 nanomembranes via remote epitaxy using hybrid molecular beam epitaxy" was published by researchers at University of Minnesota Twin Cities, Pacific Northwest National Laboratory, and University of Wisconsin–Madison. The researchers developed a new technique for making thin films of perovskite oxide semiconductors. The development c... » read more

Academic Research Paper Round-Up: April 13

By Linda Christensen - 13 Apr, 2022 - Comments: 0

The volume of research into advanced semiconductors is rising and widening. The latest batch includes hybrid power-gating architecture, RRAM devices models, improved FMEA, quantum machine learning, enhanced nonlinear optics, harvesting energy after sundown, direct chemisorption-assisted nanotransfer printing, and more. Topping the list of researchers this week are ETH Zurich, Stanford Unive... » read more

A freeze-thaw molten salt battery for seasonal storage

By Technical Paper Link - 10 Apr, 2022 - Comments: 0

New research paper from Pacific Northwest National Laboratory. Abstract "Grid-level storage of seasonal excess can be an important asset to renewable electricity. By applying the freeze-thaw thermal cycling strategy, here, we report Al-Ni molten salt batteries with effective capacity recovery over 90% after a period of 1–8 weeks as a proof-of-concept. We explore three activation methods... » read more

Week In Review: Design, Low Power

By Jesse Allen - 18 Feb, 2022 - Comments: 0

AMD completed its acquisition of Xilinx. The all-stock deal ended up being valued at approximately $50 billion due to a rise in AMD's share price (the deal was valued at $35 billion when announced). The Xilinx business will become the newly formed Adaptive and Embedded Computing Group (AECG), led by former Xilinx CEO Victor Peng, and will continue its FPGA, adaptive SoC, and software roadmaps a... » read more

New Ways To Improve Batteries

By Katherine Derbyshire - 20 Jan, 2022 - Comments: 0

Researchers around the world are racing to develop more efficient, denser, and safer battery technology, and they are reaching far beyond where research has gone before. Much of this is being driven by concern over exhaust from internal combustion engines, which are responsible for a significant portion of global CO2 emissions. Nearly all carmakers today have announced plans to develop batte... » read more

Leaky Buddies: Cross-Component Covert Channels on Integrated CPU-GPU Systems

By Technical Paper Link - 11 Aug, 2021 - Comments: 0

Find Technical Paper link here. Abstract: "Graphics Processing Units (GPUs) are ubiquitous components used across the range of today’s computing platforms, from phones and tablets, through personal computers, to high-end server class platforms. With the increasing importance of graphics and video workloads, recent processors are shipped with GPU devices that are integrated on the same chi... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Pacific Northwest National Laboratory