tag: pattern matching

Analog Design And Pattern Matching: A Perfect Pairing
By Ed Sperling - 18 Nov, 2015 - Comments: 0

While automated pattern matching is widely used in the digital IC physical verification process, adoption in the analog space has been much slower. In fact, the very nature of customized analog circuits lends itself ideally to some of the newer physical verification techniques offered by automated pattern matching technology, enabling designers to reduce verification time while still ensuring d... » read more

Capacity Constraints And DFM At Mature Nodes
By Jeff Wilson - 19 Mar, 2015 - Comments: 0

We’re witnessing an interesting phenomenon in the SoC segment of the semiconductor industry today. One might call it the “forced waterfall effect.” What I’m referring to is the tendency for production at semiconductor nodes older than the leading edge to be under long-term foundry capacity constraints. Normally this occurs with the “hot process node,” that is, the leading edge wh... » read more

Pattern Matching: Blueprints For Further Success
By Mentor, a Siemens Business - 14 Aug, 2014 - Comments: 0

Design patterns have a wide variety of applications in the design, verification and test flows of IC development. From significantly reducing rule deck complexity to simplifying the task of avoiding known yield detractors to enhancing workflows such as design rule waiver recognition, pattern matching has become a useful tool throughout design, verification, and test process. Learn how Calibre P... » read more

Good Pattern Flow Ahead For 14, 10nm
By Ann Mutschler - 21 Feb, 2013 - Comments: 0

By Ann Steffora Mutschler Given complexity, yield, power and other challenges with leading edge manufacturing, semiconductor foundries increasingly have been forced to require more and more restrictive design rules with each new process node. “They keep adding more design rules and more operations to a particular check to eliminate corner cases where in manufacturing they saw some variant... » read more

Reducing The Drama In DFM
By Ed Sperling - 24 Jan, 2013 - Comments: 0

By Ann Steffora Mutschler For reducing cycle time of DFM checks prior to manufacturing, pattern matching is a topic of great excitement as of the past few manufacturing nodes. The idea behind the technology is that there are certain patterns in the physical layout of the chip, which unless they are addressed, won’t come out right. That’s what causes the drama, observed Saleem Haider, se... » read more

A Hybrid Model/Pattern-Based OPC Approach For Improved Consistency And TAT
By Various Writers - 20 Sep, 2012 - Comments: 0

As the technology advances, OPC run time turns to be a big concern, and a great deal of our effort is directed toward speeding up the litho operations. In addition, the OPC simulation consistency sometimes deteriorates, which is a critical issue—especially for anchor features. On the other hand, full-chip designs usually comprise large arrays of basic cells, used by OPC engineers to tune OPC ... » read more

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