tag: PCB

Save Time And Minimize Errors By Automating Co-Design And Co-Analysis Of Chips, PCBs, And Packages
By Cadence - 07 Jun, 2017 - Comments: 0

Given the complexity of today’s chips, packages, and PCBs, designing each in isolation is no longer judicious. Cross-domain co-design and co-analysis are key to ensuring optimal performance, cost reduction, and faster time to market. Such capabilities are provided by the Cadence Virtuoso System Design Platform, which integrates IC design—including multiple heterogeneous die—into the Alleg... » read more

Why Is TCAM Essential For The Cloud?
By eSilicon - 27 Apr, 2017 - Comments: 0

With port speeds exceeding 100Gbps, route lookups that are fundamental to all routers have relied on ternary content addressable memories (TCAMs) to provide a lookup response within a clock cycle. However, TCAMs in discrete form are expensive, consume a lot of power, compete for precious real estate on the printed circuit board (PCB), and often lack required flexibility. Embedding a TCAM block ... » read more

Looking Back at Board Test
By Jeff Dorsch - 10 Apr, 2017 - Comments: 0

Printed circuit board testing has been around as long as printed circuit boards, also known as printed circuit assemblies and printed wiring boards. PCB technology started in the early 20th century with Thomas Edison and other inventors. As boards shrink to fit inside wearable gadgets and other products with compact form factors, PCB test equipment vendors are addressing new challenges. Boar... » read more

7 Design Aspects of IoT PCB Designs
By Mentor, a Siemens Business - 02 Mar, 2017 - Comments: 0

To consumers, IoT devices look sleek and simple, but they are comprised of a distinct set of components, physical interfaces, PCBs, and circuitry that presents unique design and layout challenges. This paper looks at seven things to consider when designing PCBs for successful IoT devices. To read more, click here. » read more

Electrothermal Mechanical Stress Reference Design Flow For Printed Circuit Boards And Electronic Packages
By Ansys - 08 Feb, 2017 - Comments: 0

This paper presents a reference design flow for solving the electrical, thermal and mechanical challenges of a printed circuit board (PCB) using simulation tools from ANSYS. This approach can be utilized for all electrical CAD (ECAD) types such as IC packages, touch panel displays, and glass and silicon interposers. The authors followed this reference design flow for analyzing a PCB virtual pro... » read more

Chip-Package-Board Issues Grow
By Ann Mutschler - 06 Feb, 2017 - Comments: 0

As systems migrate from a single die in a single package on a board, to multiple dies with multiple packaging options and multiple PCB form factors, it is becoming critical to move system planning, assembly, and optimization much earlier in the design-through-manufacturing flow. This is easier said than done. Multiple tools and operating systems are now used at each phase of the flow, partic... » read more

What’s Missing In Advanced Packaging
By Ann Mutschler - 22 Dec, 2016 - Comments: 0

Even though Moore's Law is running out of steam, there is still a need to increase functional density. Increasingly, this is being done with heterogeneous integration at the package or module level. This is proving harder than it looks. At this point there are no standardized methodologies, and tools often are retrofitted versions of existing tools that don't take into account the challenges... » read more

7nm Design Success Starts With Multi-Domain Multi-Physics Analysis
By Arvind Vel - 28 Nov, 2016 - Comments: 1

Companies can benefit from advancements in the latest semiconductor process technology by delivering smaller, faster and lower power products, especially for those servicing mobile, high performance computing and automotive ADAS applications. By using 7nm processes, design teams are able to add a lot more functionality onto a single chip and lower the power consumption by scaling operating volt... » read more

Multi-Board System Design
By Mentor, a Siemens Business - 23 Nov, 2016 - Comments: 0

The last decade has seen extraordinary advances in printed circuit board design and fabrication. There has been substantial advances across design, from schematic entry to simulation to layout and routing to team collaboration and even to the way that manufacturing data is transferred to the fabricator. But there is one place where advancement has seemingly been stalled: the overarching system-... » read more

Avoiding The Barriers For Multi-Board Systems Design Development
By Dave Wiens - 22 Nov, 2016 - Comments: 0

Designing electronic systems that comprise multiple interacting boards, connectors and cables requires a multi-discipline team collaboration to effectively manage design complexity for optimum product performance and reliability. Multi-board systems may comprise two boards or up to hundreds of boards, packing a cabinet or rack, with interconnected connectors and/or cables. Since the hardware fu... » read more

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