tag: PCM

Neuromorphic Computing: Challenges, Opportunities Including Materials, Algorithms, Devices & Ethics
By Technical Paper Link - 06 Jul, 2022 - Comments: 0

This new research paper titled "2022 roadmap on neuromorphic computing and engineering" is from numerous researchers at Technical University of Denmark, Instituto de Microelectrónica de Sevilla, CSIC, University of Seville, and many others. Partial Abstract: "The aim of this roadmap is to present a snapshot of the present state of neuromorphic technology and provide an opinion on the chall... » read more

An Energy-Efficient DRAM Cache Architecture for Mobile Platforms With PCM-Based Main Memory
By Technical Paper Link - 21 Mar, 2022 - Comments: 0

Abstract "A long battery life is a first-class design objective for mobile devices, and main memory accounts for a major portion of total energy consumption. Moreover, the energy consumption from memory is expected to increase further with ever-growing demands for bandwidth and capacity. A hybrid memory system with both DRAM and PCM can be an attractive solution to provide additional capacity ... » read more

Toward Software-Equivalent Accuracy on Transformer-Based Deep Neural Networks With Analog Memory Devices
By Technical Paper Link - 20 Dec, 2021 - Comments: 0

Abstract:  "Recent advances in deep learning have been driven by ever-increasing model sizes, with networks growing to millions or even billions of parameters. Such enormous models call for fast and energy-efficient hardware accelerators. We study the potential of Analog AI accelerators based on Non-Volatile Memory, in particular Phase Change Memory (PCM), for software-equivalent accurate i... » read more

What’s WAT? An Overview Of WAT/PCM Data
By yieldHUB - 12 Oct, 2020 - Comments: 0

Wafer acceptance testing (WAT) also known as process control monitoring (PCM) data is data generated by the fab at the end of manufacturing and generally made available to the fabless customer for every wafer. The data will typically have between forty and one hundred tests, each test having a result for each site (or “drop-in”) on the wafer. The sites are located so that the fab can monito... » read more

DRAM, 3D NAND Face New Challenges
By Mark LaPedus - 21 Sep, 2020 - Comments: 1

It’s been a topsy-turvy period for the memory market, and it's not over. So far in 2020, demand has been slightly better than expected for the two main memory types — 3D NAND and DRAM. But now there is some uncertainty in the market amid a slowdown, inventory issues and an ongoing trade war. In addition, the 3D NAND market is moving toward a new technology generation, but some are enc... » read more

Neuromorphic Computing Drives The Landscape Of Emerging Memories For Artificial Intelligence SoCs
By Synopsys - 03 Jun, 2020 - Comments: 0

The pace of deep machine learning and artificial intelligence (AI) is changing the world of computing at all levels of hardware architecture, software, chip manufacturing, and system packaging. Two major developments have opened the doors to implementing new techniques in machine learning. First, vast amounts of data, i.e., “Big Data,” are available for systems to process. Second, advanced ... » read more

Memory Issues For AI Edge Chips
By Mark LaPedus - 23 Mar, 2020 - Comments: 3

Several companies are developing or ramping up AI chips for systems on the network edge, but vendors face a variety of challenges around process nodes and memory choices that can vary greatly from one application to the next. The network edge involves a class of products ranging from cars and drones to security cameras, smart speakers and even enterprise servers. All of these applications in... » read more

What’s WAT? Testing At The End Of Manufacturing
By Marie Ryan - 10 Mar, 2020 - Comments: 0

The high costs of building, resourcing and operating a foundry fabricating integrated circuits are well known. Fabless companies avoid this capital cost and focus on design and innovation in their area of expertise. On the other hand, the fabless company relies on the expertise and skills of the foundry to produce quality wafers. Many times a process used by a fabless company to manufacture... » read more

Logic Chip, Heal Thyself
By Susan Rambo And Ed Sperling - 11 Feb, 2020 - Comments: 0

If a single fault can kill a logic chip, that doesn’t bode well for longevity of complex multi-chip systems. Obsolescence in chips is not just an industry ploy to sell more chips. It is a fact of physics that chips don’t last more than a few years, especially if overheated, and hit with higher voltage than it can stand. The testing industry does a great job finding defects during manufac... » read more

Manufacturing Bits: Dec. 16
By Mark LaPedus - 16 Dec, 2019 - Comments: 0

Imec-Leti alliance At the recent IEEE International Electron Devices Meeting (IEDM), Imec and Leti announced plans to collaborate in select areas. The two R&D organizations plan to collaborate in two areas—artificial intelligence (AI) and quantum computing. Imec and Leti have been separately working on AI technologies based on various next-generation memory architectures. Both entitie... » read more

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