tag: Photomask

Multi-Beam Begins To Shine
By Mark LaPedus - 17 Oct, 2013 - Comments: 0

After years of R&D and promises, multi-beam electron-beam technology is delayed and late to the market. The technology requires more funding and work than previously thought. And generally, the skepticism is running high for the technology. Finally, however, there is a ray of hope, and some momentum, in multi-beam—at least on the photomask front. Seeking to accelerate its multi-beam te... » read more

Debate Heats Up Over Bigger Glass
By Mark LaPedus - 17 Oct, 2013 - Comments: 0

For more than two decades, photomask makers have been talking about moving to a new and larger mask size, sometimes called “bigger glass” by the industry. Generally, the discussions about “bigger glass” have been all talk and no action. But now, some chipmakers are turning up the volume in the discussions and are pushing for a larger mask size. A larger mask size would require the ph... » read more

Challenges Mount For EUV Masks
By Mark LaPedus - 17 Oct, 2013 - Comments: 0

ASML Holding’s first production-worthy scanners for extreme ultraviolet (EUV) lithography are expected to ship this year, but there are still a number of challenges to bring the technology into high-volume manufacturing. As before, the three main challenges for EUV are the power sources, resists and photomasks. To date, the resists are making progress, while the EUV power sources remain a ... » read more

The Impact Of 14-nm Photomask Uncertainties on Computational Lithography Solutions
By Various Writers - 19 Sep, 2013 - Comments: 0

Computational lithography solutions rely upon accurate process models to faithfully represent the imaging system output for a defined set of process and design inputs. These models, in turn, rely upon the accurate representation of multiple parameters associated with the scanner and the photomask. While certain system input variables, such as scanner numerical aperture, can be empirically tuned... » read more

EUV Remains Elusive
By Ed Sperling - 31 Jul, 2012 - Comments: 0

By David Lammers Intel’s decision to invest as much as $4.1 billion in ASML has raised overall confidence levels in EUV lithography, and should allow the Dutch lithography vendor to funnel more funds into the stubbornly difficult effort to raise the EUV source power. ASML has said it needs to reach 250 Watts of average source power to achieve the 125 wph throughputs sought by its early cu... » read more

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