tag: Politecnico di Torino

Framework Based on an RISC-V Microprocessor Supporting LiM Operations
By Technical Paper Link - 29 Sep, 2022 - Comments: 0

A new technical paper titled "RISC-Vlim, a RISC-V Framework for Logic-in-Memory Architectures" was published by researchers at Politecnico di Torino (Italy), Univerity of Tor Vergata (Italy), and University of Twente (The Netherlands). Abstract: "Most modern CPU architectures are based on the von Neumann principle, where memory and processing units are separate entities. Although processin... » read more

Research Bits: May 24
By Jesse Allen - 24 May, 2022 - Comments: 0

Printed flexible OLED display Researchers from the University of Minnesota Twin Cities and Korea Institute of Industrial Technology used a customized 3D printer to print a flexible OLED display. “OLED displays are usually produced in big, expensive, ultra-clean fabrication facilities,” said Michael McAlpine, a professor in the Department of Mechanical Engineering at University of Minnes... » read more

Technical Paper Round-Up: April 19
By Linda Christensen - 19 Apr, 2022 - Comments: 0

New technical papers include selective etching, ISO 26262 test bench, hardware accelerators, RISC-V, lidar, EUV mask inspection, fault attacks, edge computing, gallium oxide, and machine learning for VLSI CAD-on-chip power grid design. Cutting-edge research is now a global effort. It extends from the U.S. Air Force, to schools such as MIT, and universities in Italy, Spain, Portugal, India, K... » read more

A Novel ISO 26262-Compliant Test Bench to Assess the Diagnostic Coverage of Software Hardening Techniques against Digital Components Random Hardware Failures
By Technical Paper Link - 18 Apr, 2022 - Comments: 0

Abstract "This paper describes a novel approach to assess detection mechanisms and their diagnostic coverage, implemented using embedded software, designed to identify random hardware failures affecting digital components. In the literature, many proposals adopting fault injection methods are available, with most of them focusing on transient faults and not considering the functional safety st... » read more

A Novel ISO 26262-Compliant Test Bench to Assess the Diagnostic Coverage of Software Hardening Techniques against Digital Components Random Hardware Failures
By Technical Paper Link - 01 Apr, 2022 - Comments: 0

New research paper from Politecnico di Torino. Abstract: "This paper describes a novel approach to assess detection mechanisms and their diagnostic coverage, implemented using embedded software, designed to identify random hardware failures affecting digital components. In the literature, many proposals adopting fault injection methods are available, with most of them focusing on transien... » read more

Research Bits: March 1
By Jesse Allen - 01 Mar, 2022 - Comments: 0

Large-scale phased array Researchers at Princeton University developed a large-scale high-frequency antenna array using thin-film materials. “To achieve these large dimensions, people have tried discrete integration of hundreds of little microchips. But that’s not practical — it’s not low-cost, it’s not reliable, it’s not scalable on a wireless systems level,” said senior stud... » read more

Reaching silicon-based NEMS performances with 3D printed nanomechanical resonators
By Technical Paper Link - 19 Oct, 2021 - Comments: 0

Abstract: "The extreme miniaturization in NEMS resonators offers the possibility to reach an unprecedented resolution in high-performance mass sensing. These very low limits of detection are related to the combination of two factors: a small resonator mass and a high quality factor. The main drawback of NEMS is represented by the highly complex, multi-steps, and expensive fabrication process... » read more

Power/Performance Bits: Jan. 2
By Jesse Allen - 02 Jan, 2019 - Comments: 0

High-temp electronics Researchers at Purdue University, UC Santa Cruz, and Stanford developed a semiconducting plastic capable of operating at extreme temperatures. The new material, which combines both a semiconducting organic polymer and a conventional insulating organic polymer could reliably conduct electricity in up to 220 degrees Celsius (428 F). "One of the plastics transports the ch... » read more

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