tag: power integrity

Minimizing EM/IR Impacts On IC Design Reliability And Performance
By Joel Mercier - 13 Sep, 2022 - Comments: 0

By Joel Mercier and Karen Chow As technologies and foundry process nodes continue to advance, it gets more difficult to design and verify integrated circuits (ICs). The challenges become even more apparent in 5nm and below nodes, and as the industry moves away from fin field-effect transistor (finFET) and into gate-all-around field-effect transistor (GAAFET) technologies. There are many prob... » read more

Overcoming The Growing Challenge Of Dynamic IR-Drop
By PV Srinivas - 24 Mar, 2022 - Comments: 0

IR-drop has always been somewhat of an issue in chip design; voltage decreases as current travels along any path with any resistance. Ohm’s Law is likely the first thing that every electrical engineer learns. But the challenges related to IR-drop (sometimes called voltage drop) have increased considerably in recent years, especially the dynamic IR-drop in the power/ground grid as circuits swi... » read more

Bringing Scalable Power Integrity Analysis To Analog IC Designs
By Joe Davis - 14 Oct, 2021 - Comments: 0

Power integrity is a broad term in integrated circuit (IC) design and verification. However, when IC engineers are working through design signoff, power integrity analysis focuses on three specific aspects of a design: Power: Verify the chip design as implemented provides the total predicted power under different operating modes. Performance: Find and eliminate performance issues affect... » read more

Chip-Package Co-Analysis Using Ansys RedHawk-CPA
By Ansys - 11 Nov, 2020 - Comments: 0

Ansys RedHawk-CPA is an integrated chip–package co-analysis solution that enables quick and accurate modeling of the package layout for inclusion in on-chip power integrity simulations using Ansys RedHawk. With RedHawk-CPA a designer can perform static IR drop analysis and AC hotspot analysis of the package layout following RedHawk static and dynamic analyses respectively. To ensure a reliab... » read more

Thermal Challenges In Advanced Packaging
By Ed Sperling - 02 Dec, 2019 - Comments: 2

CT Kao, product management director at Cadence, talks with Semiconductor Engineering about why packaging is so complicated, why power and heat vary with different use cases and over time, and why a realistic power map is essential particularly for AI chips, where some circuits are always on.   Interested in more Semiconductor Engineering videos? Sign-up for our YouTube channel here » read more

Addressing Pain Points In Chip Design
By Ed Sperling - 13 Nov, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss the impact of multi-physics and new market applications on chip design with John Lee, general manager and vice president of ANSYS' Semiconductor Business Unit; Simon Burke, distinguished engineer at Xilinx, Duane Boning, professor of electrical engineering and computer science at MIT; and Thomas Harms, director EDA/IP Alliance at Infineon. What foll... » read more

Pushing Memory Harder
By Brian Bailey - 14 Oct, 2019 - Comments: 4

In an optimized system, no component is waiting for another component while there is useful work to be done. Unfortunately, this is not the case with the processor/memory interface. Put simply, memory cannot keep up. Accessing memory is slow, and it can consume a significant fraction of the power budget. And the general consensus is this problem is not going away anytime soon, despite effort... » read more

Less Margin, More Respins, And New Markets
By Ed Sperling - 10 Oct, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss the impact of multi-physics and new market applications on chip design with John Lee, general manager and vice president of ANSYS' Semiconductor Business Unit; Simon Burke, distinguished engineer at Xilinx; Duane Boning, professor of electrical engineering and computer science at MIT; and Thomas Harms, director EDA/IP Alliance at Infineon. What foll... » read more

Multiphysics Simulations for AI Silicon to System Success
By Ansys - 09 Oct, 2019 - Comments: 0

Achieving power efficiency, power integrity, signal integrity, thermal integrity and reliability is paramount for enabling product success by overcoming the challenges of size and complexity in AI hardware and optimizing the same for rapidly evolving AI software. ANSYS’ comprehensive chip, package and system solutions empower AI hardware designers by breaking down design margins and siloed de... » read more

Delivering High-Speed Communications: The Back Story
By Mike Gianfagna - 30 May, 2019 - Comments: 0

Back in January, I posted a blog about what it takes to deliver high-speed communication. In that post, I talked about a new test board for our high-speed 7nm 56G PAM4 & NRZ DSP-based long-reach SerDes. We collaborated with several companies to build a high-precision board that could be used to test our SerDes in a system context. At that time, we were just finishing the opening act for thi... » read more

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